NB3L553DG ON Semiconductor, NB3L553DG Datasheet - Page 3

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NB3L553DG

Manufacturer Part Number
NB3L553DG
Description
IC CLK FANOUT BUFFER 1:4 8-SOIC
Manufacturer
ON Semiconductor
Type
Fanout Buffer (Distribution)r
Datasheet

Specifications of NB3L553DG

Number Of Circuits
1
Ratio - Input:output
1:4
Differential - Input:output
No/No
Input
LVCMOS, LVTTL
Output
LVCMOS, LVTTL
Frequency - Max
200MHz
Voltage - Supply
2.38 V ~ 5.25 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Frequency-max
200MHz
Number Of Outputs
4
Max Input Freq
200 MHz
Propagation Delay (max)
5 ns @ 2.5V or 4 ns @ 5V
Supply Voltage (max)
5.25 V
Supply Voltage (min)
2.375 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NB3L553DG
NB3L553DGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NB3L553DG
Manufacturer:
ON
Quantity:
1 446
Part Number:
NB3L553DG
Manufacturer:
Cypress
Quantity:
37
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)
Table 3. MAXIMUM RATINGS
Symbol
V
T
q
q
q
q
T
V
DD
stg
JA
JC
JA
JC
A
I
Positive Power Supply
Input Voltage
Operating Temperature Range,
Industrial
Storage Temperature Range
Thermal Resistance
(Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Thermal Resistance
(Junction−to−Ambient)
Thermal Resistance (Junction−to−Case)
Table 4. ATTRIBUTES
2. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 2)
Flammability Rating
Transistor Count
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
Parameter
Characteristic
Condition 1
GND = 0 V
500 lfpm
500 lfpm
(Note 1)
(Note 1)
http://onsemi.com
0 lfpm
0 lfpm
I
OE
CLK
Oxygen Index: 28 to 34
Charged Device Model
Human Body Model
3
Machine Model
V
DD
GND = 0 V and
= 2.375 V to 5.25 V
Condition 2
SOIC−8
SOIC−8
DFN8
DFN8
DFN8
UL−94 code V−0 @ 0.125 in
531 Devices
GND – 0.5 v V
> TBD kV
> 150 V
Level 1
> 2 kV
GND – 0.5 v V
Value
≥ −40 to ≤ +85
−65 to +150
41 to 44
35 to 40
Rating
190
130
129
6.0
84
I
v V
I
v 5.75
DD
+ 0.5
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V

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