GD16334100BA Intel, GD16334100BA Datasheet - Page 5

• Manufacturer Part Number: GD16334100BA
• Manufacturer: Intel

Specifications of GD16334100BA

• Operating Temperature (max): 85C
• Pin Count: 100
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Not Compliant

Maximum Ratings
These are the limits beyond which the component may be damaged.
All voltages in table are referred to VEE.
All currents are defined positive in to the pin.
Thermal Characteristics
Thermal Considerations
A heat-conducting slug is placed at the bottom of the package allowing heat dissipation out of the bottom of the IC package to the
PCB. The heat slug can be soldered to a conducting plane (VEE) on the PCB using solder paste, or a thermally conducting foil can
be placed under the package. If the thermal foil method is preferred, a 0.25 mm thick foil may be used.
Via holes for heat transfer to the other side of the PCB should be made and a heat sink can be attached on the opposite side of the
PCB if required.
Data Sheet Rev. 10
Symbol:
V
V
V
I
I
V
I
T
T
Symbol:
T
O
O
I
DDC
DD
O
I
j
s
o
max
max
max-CMOS
max
max
Characteristic:
Supply Voltage CMOS
Supply Voltage
Output Voltage
Output Current
Output Current
Input Voltage
Input Current
Operating Temperature
Storage Temperature
Characteristic:
Thermal resistance, junction to case
Thermal resistance, junction to ambient
Operating Temperature
GD16334
Conditions:
rel. to V
rel. to V
CML
CMOS
Junction
Conditions:
Still air, Horizontal
mounting
Case
EE
EE
MIN.:
MIN.:
-0.5
-0.5
-1.0
-15
-30
-55
-65
-5
0
0
TYP.:
TYP.:
11.7
42
V
V
MAX.:
MAX.:
DD
DD
+85
125
150
1.0
30
6
6
0
+0.5
+0.5
UNIT:
UNIT
C/W
C/W
Page 5
mA
mA
mA
C
V
V
V
V
C
C