MT46H8M32LFB5-6IT:H Micron Technology Inc, MT46H8M32LFB5-6IT:H Datasheet - Page 15

• Manufacturer Part Number: MT46H8M32LFB5-6IT:H
• Description: MICMT46H8M32LFB5-6_IT:H MDDDR
• Manufacturer: Micron Technology Inc

Package Dimensions
Figure 6: 60-Ball VFBGA (8mm x 9mm)
PDF: 09005aef834bf85b
256mb_mobile_ddr_sdram_t36n.pdf - Rev. I 09/10 EN
Solder ball material:
SAC105 (98.5% Sn,
1% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.4 SMD ball pads.
60X Ø0.45
Seating
plane
7.2 CTR
0.1 A
0.8 TYP
Note:
A
9
1. All dimensions are in millimeters.
8
7
0.8 TYP
6.4 CTR
8 ±0.1
3
2
1
0.65 ±0.05
A
B
C
D
E
F
G
H
J
K
15
9 ±0.1
256Mb: x16, x32 Mobile LPDDR SDRAM
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.0 MAX
Package Dimensions
© 2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID