EP2C35F672C8N Altera, EP2C35F672C8N Datasheet - Page 83

• Manufacturer Part Number: EP2C35F672C8N
• Description: IC CYCLONE II FPGA 33K 672-FBGA
• Manufacturer: Altera
• Series: Cyclone® IIr

Specifications of EP2C35F672C8N

• Number Of Logic Elements/cells: 33216
• Number Of Labs/clbs: 2076
• Total Ram Bits: 483840
• Number Of I /o: 475
• Voltage - Supply: 1.15 V ~ 1.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 672-FBGA
• No. Of Logic Blocks: 2076
• Family Type: Cyclone II
• No. Of I/o's: 475
• I/o Supply Voltage: 3.3V
• Operating Frequency Max: 320MHz
• Operating Temperature Range: 0°C To +85°C
• Rohs Compliant: Yes
• For Use With: NANO-CYCLONE - KIT NANOBOARD AND CYCLONEII DC807-1002 - DAUGHTER CARD ALTERA CYCLONE IIP0301 - DE2 CALL FOR ACADEMIC PRICING544-1733 - PCI KIT W/CYCLONE II EP2C35N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Other names: 544-1692

Introduction
Cyclone II
Hot-Socketing
Specifications
Altera Corporation
February 2007
CII51004-3.1
Cyclone
insertion, or hot swap) and power sequencing support without the use of
any external devices. You can insert or remove a Cyclone II board in a
system during system operation without causing undesirable effects to
the board or to the running system bus.
The hot-socketing feature lessens the board design difficulty when using
Cyclone II devices on printed circuit boards (PCBs) that also contain a
mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices. With the Cyclone II
hot-socketing feature, you no longer need to ensure a proper power-up
sequence for each device on the board.
The Cyclone II hot-socketing feature provides:
■
■
■
This chapter also discusses the power-on reset (POR) circuitry in
Cyclone II devices. The POR circuitry keeps the devices in the reset state
until the V
Cyclone II devices offer hot-socketing capability with all three features
listed above without any external components or special design
requirements. The hot-socketing feature in Cyclone II devices offers the
following:
■
■
Board or device insertion and removal without external components
or board manipulation
Support for any power-up sequence
Non-intrusive I/O buffers to system buses during hot insertion
The device can be driven before power-up without any damage to
the device itself.
I/O pins remain tri-stated during power-up. The device does not
drive out before or during power-up, thereby affecting other buses
in operation.
®
II devices offer hot socketing (also known as hot plug-in, hot
CC
is within operating range.
4. Hot Socketing & Power-On
Reset
4–1