XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 102

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XCV812E-8FG900C

Manufacturer Part Number
XCV812E-8FG900C
Description
IC FPGA 1.8V C-TEMP 900-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-E EMr
Datasheet

Specifications of XCV812E-8FG900C

Number Of Logic Elements/cells
21168
Number Of Labs/clbs
4704
Total Ram Bits
1146880
Number Of I /o
556
Number Of Gates
254016
Voltage - Supply
1.71 V ~ 1.89 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
900-BBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
FG900 Fine-Pitch Ball Grid Array Package
The XCV812E Virtex-E Extended Memory devices are
available in the FG900 fine-pitch BGA package. Pins
labeled I0_VREF can be used as either. If the pin is not
used as V
following
tial Pair information.
Table 5:
Module 4 of 4
26
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table
REF
FG900 Fine-Pitch BGA Package — XCV812E
, it can be used as general I/O. Immediately
5, see
IO_VREF_L5N_YY
Table 6
Description
IO_L4N_YY
IO_L4P_YY
IO_L5P_YY
IO_L1N_Y
IO_L2N_Y
IO_L1P_Y
IO_L2P_Y
IO_VREF
IO_L6N
IO_L7N
IO_L6P
IO_L7P
GCK3
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
for FG900 package Differen-
G12
G15
C15
A13
C10
D10
H15
K12
N11
F15
Pin
J10
C9
D5
G8
H9
D6
D7
A7
E6
F7
F9
A9
A3
A4
E7
B5
A5
F8
www.xilinx.com
1-800-255-7778
Table 5:
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
FG900 Fine-Pitch BGA Package — XCV812E
IO_VREF_L13N_YY
IO_VREF_L23N_YY
IO_VREF_L27N_YY
IO_VREF_L9N_YY
IO_L12N_YY
IO_L22N_YY
IO_L26N_YY
IO_L12P_YY
IO_L13P_YY
IO_L22P_YY
IO_L23P_YY
IO_L26P_YY
IO_L27P_YY
Description
IO_L8N_YY
IO_L8P_YY
IO_L9P_YY
IO_L19N_Y
IO_L19P_Y
IO_L20N_Y
IO_L20P_Y
IO_L10N
IO_L10P
IO_L11N
IO_L11P
IO_L15N
IO_L15P
IO_L17N
IO_L17P
IO_L24N
IO_L24P
IO_L25N
IO_L25P
IO_L28N
IO_L28P
DS025-4 (v1.6) July 17, 2002
H10
G10
H11
G11
B10
H13
E11
D11
C11
A10
D12
E12
A11
G13
B12
A12
K13
B13
G14
E13
F10
F11
F12
F13
Pin
J11
J12
G9
E8
A6
C7
B7
C8
A8
B9
R

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