XCV812E-8FG900C Xilinx Inc, XCV812E-8FG900C Datasheet - Page 117

• Manufacturer Part Number: XCV812E-8FG900C
• Description: IC FPGA 1.8V C-TEMP 900-FBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-E EMr

Specifications of XCV812E-8FG900C

• Number Of Logic Elements/cells: 21168
• Number Of Labs/clbs: 4704
• Total Ram Bits: 1146880
• Number Of I /o: 556
• Number Of Gates: 254016
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 900-BBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Virtex-E Extended Memory Device/Package Combinations and Maximum I/O
Virtex-E Ordering Information
Virtex-II ordering information is shown in
DS025-4 (v1.6) July 17, 2002
Virtex-E Extended Memory Series Maximum User I/O by Device/Package (Excluding Dedicated Clock Pins)
R
Package
BG560
FG676
FG900
Example: XCV405E-6BG560C
Device Type
Speed Grade
(-6, -7, -8)
Figure 1
Figure 1: Virtex Ordering Information
Virtex™-E 1.8 V Extended Memory Field Programmable Gate Arrays
www.xilinx.com
1-800-255-7778
XCV405E
404
404
Temperature Range
C = Commercial (T
I = Industrial (T
Number of Pins
Package Type
BG = Ball Grid Array
FG = Fine Pitch Ball Grid Array
J
= −40˚C to +100˚C)
J
= 0˚C to +85˚C)
DS025_001_112000
XCV812E
404
556
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