MPC8313VRADDB Freescale Semiconductor, MPC8313VRADDB Datasheet - Page 51

MPU POWERQUICC II PRO 516-PBGA

MPC8313VRADDB

Manufacturer Part Number
MPC8313VRADDB
Description
MPU POWERQUICC II PRO 516-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8313VRADDB

Processor Type
MPC83xx PowerQUICC II Pro 32-Bit
Speed
267MHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
516-PBGA
Processor Series
MPC8xxx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
MPC8313E-RDB
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
- 0.3 V to + 1.26 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Data Ram Size
16 KB
I/o Voltage
2.5 V
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
Program Memory Type
EEPROM/Flash
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Manufacturer
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Price
Part Number:
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Manufacturer:
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Part Number:
MPC8313VRADDB
Manufacturer:
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12 JTAG
This section describes the DC and AC electrical specifications for the IEEE Std 1149.1™ (JTAG)
interface.
12.1
Table 47
12.2
This section describes the AC electrical specifications for the IEEE Std 1149.1 (JTAG) interface.
Table 48
Freescale Semiconductor
At recommended operating conditions (see
Input high voltage
Input low voltage
Input current
Output high voltage
Output low voltage
Output low voltage
JTAG external clock frequency of operation
JTAG external clock cycle time
JTAG external clock pulse width measured at 1.4 V
JTAG external clock rise and fall times
TRST assert time
Input setup times:
Input hold times:
Valid times:
provides the DC electrical characteristics for the IEEE Std 1149.1 (JTAG) interface.
provides the JTAG AC timing specifications as defined in
JTAG DC Electrical Characteristics
JTAG AC Timing Specifications
Characteristic
Table 48. JTAG AC Timing Specifications (Independent of SYS_CLK_IN)
MPC8313E PowerQUICC
Parameter
Table 47. JTAG Interface DC Electrical Characteristics
Boundary-scan data
Boundary-scan data
Boundary-scan data
Table
2).
TMS, TDI
TMS, TDI
II Pro Processor Hardware Specifications, Rev. 3
Symbol
V
V
V
TDO
V
V
I
IN
OH
OL
OL
IH
IL
t
JTGR
Symbol
t
t
t
t
t
t
t
JTDVKH
JTDXKH
JTKHKL
JTKLDV
JTKLOV
t
JTIVKH
JTIXKH
t
TRST
f
I
JTG
OH
I
JTG
I
& t
OL
OL
Condition
JTGF
= –8.0 mA
= 3.2 mA
= 8.0 mA
2
Min
Figure 41
30
15
25
10
10
0
0
4
4
2
2
–0.3
Min
2.1
2.4
through
Max
33.3
11
11
2
NV
Figure
DD
1
Max
0.8
0.5
0.4
±5
MHz
+ 0.3
Unit
ns
ns
ns
ns
ns
ns
ns
45.
Notes
Unit
μA
V
V
V
V
V
4
4
5
3
JTAG
51

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