MCP2022-330E/SL Microchip Technology, MCP2022-330E/SL Datasheet - Page 33

• Manufacturer Part Number: MCP2022-330E/SL
• Description: IC LIN TXRX 3.3V 50MA 14-SOIC
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2022-330E/SL

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Data Rate: 20Kbps
• Supply Voltage Range: 6V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 14
• Operating Temperature Range: -40°C To +125°C
• Interface: EUSART
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
b1
eB
E1
N
A
E
D
e
L
c
b
A2
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
MCP2021/2
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS22018E-page 33