MCP2022-330E/SL Microchip Technology, MCP2022-330E/SL Datasheet - Page 36

• Manufacturer Part Number: MCP2022-330E/SL
• Description: IC LIN TXRX 3.3V 50MA 14-SOIC
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2022-330E/SL

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Data Rate: 20Kbps
• Supply Voltage Range: 6V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 14
• Operating Temperature Range: -40°C To +125°C
• Interface: EUSART
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MCP2021/2
DS22018E-page 36
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
A2
E1
.015
.290
.240
.735
.008
.045
.014
MIN
.115
.115
–
–
L
.100 BSC
INCHES
NOM
.130
.310
.250
.750
.130
.010
.060
.018
14
–
–
–
Microchip Technology Drawing C04-005B
© 2009 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
–
E
c