MCP2022-330E/SL Microchip Technology, MCP2022-330E/SL Datasheet - Page 37

• Manufacturer Part Number: MCP2022-330E/SL
• Description: IC LIN TXRX 3.3V 50MA 14-SOIC
• Manufacturer: Microchip Technology
• Type: Transceiverr

Specifications of MCP2022-330E/SL

• Number Of Drivers/receivers: 1/1
• Protocol: LIN
• Voltage - Supply: 6 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Data Rate: 20Kbps
• Supply Voltage Range: 6V To 18V
• Logic Case Style: SOIC
• No. Of Pins: 14
• Operating Temperature Range: -40°C To +125°C
• Interface: EUSART
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

© 2009 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
1
N
2
b
3
D
Dimension Limits
e
Units
A2
A1
E1
L1
E1
D
N
A
E
α
e
h
L
φ
c
b
β
A2
E
MIN
1.25
0.10
0.25
0.40
0.17
0.31
φ
0°
5°
5°
–
L
MILLIMETERS
h
8.65 BSC
1.27 BSC
6.00 BSC
3.90 BSC
1.04 REF
L1
NOM
14
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-065B
h
MCP2021/2
β
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
DS22018E-page 37
α
c