BGY288 NXP Semiconductors, BGY288 Datasheet - Page 17

• Manufacturer Part Number: BGY288
• Manufacturer: NXP Semiconductors

Specifications of BGY288

• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / Rohs Status: Supplier Unconfirmed

Philips Semiconductors
12. Soldering Recommendations
9397 750 14011
Preliminary data sheet
12.1 Reflow profile
12.2 Printed-circuit board layout
The BGY288 is a laminate-based power amplifier module in a Leadless Grid Array (LGA)
package. The module can be assembled using a standard Surface Mount Technology
(SMT) reflow process in a convection or IR-oven. The minimum and maximum limits of the
temperature profile are shown in
and will depend on the printed-circuit board material, the number and size of the
components to be assembled, and the type of solder which is being used.
It is recommended to use a standard no-clean solder paste like SnPb for profiles having
leads containing solder, or SnAgCu for lead-free assembly processes. The parameters
and corresponding values for SnPb and SnAgCu solder are given in
Table 10:
The printed-circuit board footprint layout is a copy of the metal pattern on the underside of
the LGA package. It is recommended that the printed-circuit board is designed with a
large ground plane, and that the solder lands of the ground plane solder mask are defined
as shown in
Symbol
T
t
T
t
T
E
R
Fig 8. Recommended reflow temperature profile
E
R
P
T
T
E(max)
E(min)
temperature
T
T
R
P
Reflow soldering parameters
parameter
temperature gradient
pre-heat (soak) temperature
pre-heat time
reflow temperature
reflow time
maximum peak temperature
temperature gradient
time 25 C to peak temperature
Figure
9.
Rev. 01 — 2 February 2005
Figure
t
E
8. The actual profile has to be within these limits,
Power amplifier with integrated control loop
SnPb Solder
100 to 150
60 to 120
> 183
60 to 150
240
< 5
6 minutes max.
3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
t
R
SnAgCu solder
150 to 200
60 to 180
> 217
60 to 150
260
< 5
8 minutes max.
3
Table
BGY288
10.
001aaa705
t
17 of 22
Unit
s
s
C/s
C
C
C
C/s