TE28F160C3BA90 Micron Technology Inc, TE28F160C3BA90 Datasheet - Page 15

• Manufacturer Part Number: TE28F160C3BA90
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3BA90

• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

C3 Discrete
3.3
Figure 4:
March 2008
290645-24
Dimensions Table
Note: (1) Package dimensions are for reference only. These dimensions are estimates based
on die size, and are subject to change.
Package Height
Ball Height
Package Body Thickness
Ball (Lead) Width
Package Body Width
Package Body Length
Pitch
Ball (Lead) Count
Seating Plane Coplanarity
Corner to Ball A1 Distance Along D
Corner to Ball A1 Distance Along E
Easy BGA Package Drawing and Dimension
Ball A1
Corner
Easy BGA Package
E
A2
B
C
D
E
F
G
H
A
1
Top View - Ball side down
A1
2
3
Side View
4
D
5
6
Symbol
A
A
[e]
S
S
7
A
D
N
b
E
Y
1
2
1
2
8
Millimeters
12.900
0.250
0.330
9.900
1.400
2.900
Min
A
A
B
C
D
G
H
E
F
10.000
13.000
0.780
0.430
1.000
1.500
3.000
Nom
8
64
Seating
Plane
Bottom View - Ball Side Up
7
10.100
13.100
1.200
0.530
0.100
1.600
3.100
6
Max
5
Notes
Note: Drawing not to scale
4
1
1
1
1
3
Inches
0.0098
0.0130
0.3898
0.5079
0.0551
0.1142
Min
2
1
Y
S1
0.0307
0.0169
0.3937
0.5118
0.0394
0.0591
0.1181
Nom
64
b
e
S2
Ball A1
Corner
0.0472
0.0209
0.3976
0.5157
0.0039
0.0630
0.1220
Max
Datasheet
15