TE28F160C3BA90 Micron Technology Inc, TE28F160C3BA90 Datasheet - Page 16

• Manufacturer Part Number: TE28F160C3BA90
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3BA90

• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

4.0
4.1
Figure 5:
Datasheet
16
64 M
32 M
16 M
48-Lead TSOP Package
Ballout and Signal Descriptions
The C3 device is available in 48-lead TSOP, 48-ball VF BGA, 48-ball μBGA, and Easy
BGA packages. See
page
48-Lead TSOP Package
A
A
A
A
A
A
A
A
A
A
WE#
RP#
V
WP#
A
A
A
A
A
A
A
A
A
A
15
14
13
12
11
10
9
8
21
20
PP
19
18
17
7
6
5
4
3
2
1
19, respectively.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
1
2
3
4
5
6
7
8
9
Figure 5 on page
Advanced+ Boot Block
12 mm x 20 mm
48-Lead TSOP
TOP VIEW
16,
Figure 7 on page
18, and
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
Figure 8 on
A
V
GND
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
V
DQ
DQ
DQ
DQ
DQ
DQ
DQ
DQ
OE#
GND
CE#
A
0
16
CCQ
CC
15
7
14
6
13
5
12
4
11
3
10
2
9
1
8
0
C3 Discrete
March 2008
290645-24