TE28F160C3BA90 Micron Technology Inc, TE28F160C3BA90 Datasheet - Page 3

• Manufacturer Part Number: TE28F160C3BA90
• Manufacturer: Micron Technology Inc

Specifications of TE28F160C3BA90

• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 20b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 16b
• Number Of Words: 1M
• Supply Current: 18mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

C3 Discrete
Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Modes of Operation ................................................................................................. 41
March 2008
290645-24
Introduction .............................................................................................................. 7
1.1
1.2
Functional Overview .................................................................................................. 9
2.1
2.2
2.3
Package Information ............................................................................................... 13
3.1
3.2
3.3
Ballout and Signal Descriptions ............................................................................... 16
4.1
4.2
4.3
Maximum Ratings and Operating Conditions............................................................ 21
5.1
5.2
Electrical Specifications ........................................................................................... 23
6.1
6.2
AC Characteristics ................................................................................................... 26
7.1
7.2
7.3
7.4
7.5
Power and Reset Specifications ............................................................................... 36
8.1
8.2
8.3
8.4
8.5
8.6
Device Operations ................................................................................................... 39
9.1
Nomenclature ..................................................................................................... 7
Conventions ....................................................................................................... 8
Product Overview ................................................................................................ 9
Block Diagram .................................................................................................. 10
Memory Map..................................................................................................... 10
mBGA* and VF BGA Package .............................................................................. 13
TSOP Package................................................................................................... 14
Easy BGA Package............................................................................................. 15
48-Lead TSOP Package ...................................................................................... 16
64-Ball Easy BGA Package .................................................................................. 19
Signal Descriptions ............................................................................................ 19
Absolute Maximum Ratings................................................................................. 21
Operating Conditions ......................................................................................... 21
Current Characteristics....................................................................................... 23
DC Voltage Characteristics.................................................................................. 24
AC Read Characteristics ..................................................................................... 26
AC Write Characteristics ..................................................................................... 30
Erase and Program Timings ................................................................................ 34
AC I/O Test Conditions....................................................................................... 34
Device Capacitance ........................................................................................... 35
Active Power (Program/Erase/Read) .................................................................... 36
Automatic Power Savings (APS) .......................................................................... 36
Standby Power.................................................................................................. 36
Deep Power-Down Mode..................................................................................... 36
Power and Reset Considerations .......................................................................... 37
8.5.1
8.5.2
8.5.3
8.5.4
Power Supply Decoupling ................................................................................... 38
Bus Operations ................................................................................................. 39
9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
Power-Up/Down Characteristics................................................................ 37
RP# Connected to System Reset .............................................................. 37
VCC, VPP and RP# Transitions.................................................................. 37
Reset Specifications................................................................................ 37
Read .................................................................................................... 39
Write .................................................................................................... 39
Output Disable ....................................................................................... 39
Standby ................................................................................................ 39
Reset.................................................................................................... 40
Datasheet
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