S29GL256M10TAIR10 Spansion Inc., S29GL256M10TAIR10 Datasheet - Page 11
S29GL256M10TAIR10
Manufacturer Part Number
S29GL256M10TAIR10
Description
Manufacturer
Spansion Inc.
Datasheet
1.S29GL256M10TAIR10.pdf
(116 pages)
Specifications of S29GL256M10TAIR10
Cell Type
NOR
Density
256Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25/24Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3/11.5 to 12.5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
32M/16M
Supply Current
60mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
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Note: Ball H7 is V
Special Package Handling Instructions
February 7, 2007 S29GL-M_00_B8
IO
NC*
NC*
NC*
NC*
A8
A7
A2
A1
on S29GL064M (model R5).
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to tempera-
tures above 150°C for prolonged periods of time.
NC*
NC*
NC*
B8
B7
B1
RY/BY#
A13
WE#
C5
C4
C3
C2
C7
C6
A9
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
WP#/ACC
RESET#
D a t a
A12
A17
D7
D6
A8
D5
D4
D3
D2
A4
S29GL-M MirrorBit
Top View, Balls Facing Down
63-Ball Fine-Pitch BGA
A14
A10
A21
A18
E7
E6
E5
E4
E3
A6
E2
A2
S h e e t
A15
A11
A19
A20
A5
A1
F7
F6
F5
F4
F3
F2
TM
DQ7
DQ5
DQ2
DQ0
A16
G7
G6
G5
G4
G3
G2
A0
Flash Family
BYTE#
DQ14
DQ12
DQ10
DQ8
CE#
H7
H6
H5
H4
H3
H2
1
DQ15/A-1
DQ13
DQ11
DQ9
OE#
V
J7
J6
J5
J4
J3
J2
CC
DQ6
DQ4
DQ3
DQ1
V
V
K7
K6
K5
K4
K3
K2
SS
SS
NC*
NC*
NC*
NC*
L8
L7
L2
L1
NC*
NC*
NC*
NC*
M8
M7
M2
M1
9
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