S29GL256M10TAIR10 Spansion Inc., S29GL256M10TAIR10 Datasheet - Page 6

• Manufacturer Part Number: S29GL256M10TAIR10
• Manufacturer: Spansion Inc.

Specifications of S29GL256M10TAIR10

• Cell Type: NOR
• Density: 256Mb
• Access Time (max): 100ns
• Interface Type: Parallel
• Boot Type: Not Required
• Address Bus: 25/24Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 3/11.5 to 12.5V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 32M/16M
• Supply Current: 60mA
• Mounting: Surface Mount
• Pin Count: 56
• Lead Free Status / Rohs Status: Not Compliant

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . 77
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . .77
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .78
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . .79
Key to Switching Waveforms . . . . . . . . . . . . . . . .79
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .80
4
CMOS Compatible ............................................................................................ 78
Read-Only Operations—S29GL256M Only ...............................................80
Read-Only Operations—S29GL128M only ................................................ 80
Read-Only Operations—S29GL064M Only ............................................... 81
Read-Only Operations—S29GL032M only ................................................ 82
Hardware Reset (RESET#) ...............................................................................83
Erase and Program Operations—S29GL256M Only ............................... 85
Erase and Program Operations—S29GL128M Only ............................... 86
Erase and Program Operations—S29GL064M Only .............................. 87
Erase and Program Operations—S29GL032M Only .............................. 88
Temporary Sector Unprotect ......................................................................... 91
Figure 9. Maximum Negative Overshoot Waveform ................. 77
Figure 10. Maximum Positive Overshoot Waveform................. 77
Figure 11. Test Setup ......................................................... 79
Table 37. Test Specifications ............................................... 79
Figure 12. Input Waveforms and Measurement Levels............. 79
Figure 13. Read Operation Timings ....................................... 82
Figure 14. Page Read Timings .............................................. 83
Figure 15. Reset Timings..................................................... 84
Figure 16. Program Operation Timings .................................. 89
Figure 17. Accelerated Program Timing Diagram .................... 89
Figure 18. Chip/Sector Erase Operation Timings ..................... 90
Figure 19. Data# Polling Timings
(During Embedded Algorithms) ............................................ 90
Figure 20. Toggle Bit Timings (During Embedded Algorithms) .. 91
Figure 21. DQ2 vs. DQ6 ...................................................... 91
Figure 22. Temporary Sector Group Unprotect Timing Diagram 92
S29GL-M MirrorBit
D a t a
TM
Erase and Programming Performance . . . . . . . . . 98
TSOP Pin and BGA Package Capacitance . . . . . .98
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 99
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 110
Flash Family
Alternate CE# Controlled Erase and Program Operations—
S29GL256M .......................................................................................................... 93
Alternate CE# Controlled Erase and Program Operations—
S29GL128M ...........................................................................................................94
Alternate CE# Controlled Erase and Program Operations—
S29GL064M .......................................................................................................... 95
Alternate CE# Controlled Erase and Program Operations—
S29GL032M ..........................................................................................................96
TS040—40-Pin Standard Thin Small Outline Package (TSOP) ............99
TSR040—40-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ................................................................................................................. 100
TS048—48-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ...................................................................................................................101
TSR048—48-Pin Standard and Reverse Thin Small Outline Package
(TSOP) ..................................................................................................................102
TS056/TSR056—56-Pin Standard and Reverse Thin Small Outline Pack-
age (TSOP) ..........................................................................................................103
LAA064—64-Ball Fortified Ball Grid Array (FBGA) ..............................104
LAC064—64-Pin 18 x 12 mm Package .........................................................105
FBA048—48-Pin 6.15 x 8.15 mm Package ...................................................106
FBC048—48-Pin 8 x 9 mm Package ............................................................107
FBE063—63-Pin 12 x 11 mm Package ........................................................... 108
FPT-48P-M19 ...................................................................................................... 109
FPT-56P-M01 ....................................................................................................... 109
Figure 23. Sector Group Protect and Unprotect Timing Diagram 92
Figure 24. Alternate CE# Controlled Write (Erase/
Program) Operation Timings ............................................... 97
S h e e t
S29GL-M_00_B8 February 7, 2007