TDA6500TT NXP Semiconductors, TDA6500TT Datasheet - Page 34

• Manufacturer Part Number: TDA6500TT
• Manufacturer: NXP Semiconductors

Specifications of TDA6500TT

• Pin Count: 32
• Screening Level: Commercial
• Package Type: TSSOP
• Lead Free Status / Rohs Status: Compliant

Philips Semiconductors
9397 750 15057
Product data sheet
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These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
5 V mixer/oscillator and synthesizer for PAL and NTSC standards
Rev. 02 — 14 June 2005
TDA6500; TDA6501
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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