B300D44A102XXG ON Semiconductor, B300D44A102XXG Datasheet
B300D44A102XXG
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B300D44A102XXG Summary of contents
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... Pb−Free XXXX = Date Code Y = Assembly Plant Identifier = (May be Two Characters Traceability Code ORDERING INFORMATION Device Package B300W35A102XYG WLCSP (Pb−Free) B300D44A102XXG (Pb−Free) 2 C−based 1 WLCSP−35 W SUFFIX CASE 567AG Shipping 2500 Units / Reel DFN 2500 Units / Reel Publication Order Number: B300/D ...
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Integrated A/D Converters and Powered Output: minimize need for external components • Flexible Clocking Architecture: supports speeds MHz • “Smart” Power Management: including low current standby mode requiring only 0.06 mA • Diverse Memory Architecture: 4864x48−bit ...
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Figures and Data Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Voltage at any input pin Operating supply voltage (Note 1) Operating temperature range (Note 2) Storage temperature range (Note 3) Caution: Class 2 ESD Sensitivity, JESD22−A114−B (2000 V) Stresses exceeding Maximum ...
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Table 2. ELECTRICAL SPECIFICATIONS Description Symbol VDBL (1 mF External Capacitor) Regulator PSRR VDBL PSRR Load current I LOAD Load regulation LOAD REG Line regulation LINE REG VDDC (1 mF External Capacitor) Digital supply voltage output VDDC VDDC output level ...
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Table 2. ELECTRICAL SPECIFICATIONS Description Symbol DIRECT DIGITAL OUTPUT Maximum load current I DO Output impedance R DO Output dynamic range DO DR Output THD+N DO THDN Output voltage DO VOUT ANTI−ALIASING FILTERS (Input and Output) Preamplifier filter cut−off frequency ...
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... All BelaSigna 300 packages are Pb−free, RoHS−compliant and Green. BelaSigna 300 parts are qualified against standards outlined in the following sections. All BelaSigna 300 package options are Green (RoHS−compliant). Contact ON Semiconductor for supporting documentation. WLCSP Package Option The solder ball composition for the WLCSP package is SAC266. Table 3. WLCSP PACKAGE− ...
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WLCSP Pin Out A total of 35 active pins are present on the BelaSigna 300 WLCSP package. They are organized in a staggered array. A description of these pins is given in Table 7. Table 7. WLCSP PAD DESCRIPTIONS Pad ...
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... ON Semiconductor can provide BelaSigna 300 WLCSP land pattern CAD files to assist your PCB design upon request. Description Ground for output driver ...
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Table 8. DFN PAD DESCRIPTIONS Pad Index BelaSigna 300 Pad Name 28 VDDO_SPI 32 SPI_CLK 31 SPI_SERI 30 SPI_CS 29 SPI_SERO 37 SDA (I2C) 36 SCL (I2C) 35 EXT_CLK 27 PCM_FR 26 PCM_SERI 25 PCM_SERO 24 PCM_CLK 23 Reserved DFN ...
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The DGND plane is used as the ground return for digital circuits and should be placed under digital circuits. The AGND plane should be kept as noise−free as possible used as the ground return for analog circuits and ...
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Table 10. NON−CRITICAL SIGNALS Pin Name CAP0, CAP1 SDA, SCL GPIO[3..0] UART_RX, UART_TX PCM_FRAME, PCM_CLK, PCM_OUT, PCM_IN LSAD[4..1] SPI_CLK, SPI_CS, SPI_SERI, SPI_SERO Audio Inputs The audio input traces should be as short as possible. The input impedance of each audio ...
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Table 11. RECOMMENDATIONS FOR UNUSED PADS WLCSP Ball Index DFN Pin Index Architecture Overview The architecture of BelaSigna 300 is shown in Figure 2. Downsampling Downsampling ...
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CFX DSP Core The CFX DSP is a user−programmable general−purpose DSP core that uses a 24−bit fixed−point, dual−MAC, dual−Harvard architecture able to perform two MACs, two memory operations and two pointer updates per cycle, making it well−suited to ...
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CFX DSP Instruction Set Table 12 shows the list of all general CFX instructions and their description. Many instructions have multiple variations not shown in the table. Please refer to the CFX DSP Architecture Manual for more details. Table 12. ...
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Table 12. CFX SUMMARY INSTRUCTION SET Instruction RETURNI Return from an interrupt SHLL Shift a data register left logically SHRA Shift a data register right arithmetically SHRL Shift a data register right logically SLEEP Enter sleep mode and wait for ...
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Shared Memories The shared CFX/HEAR memories include the following: Table 14. SHARED MEMORIES Type Data memory (RAM) H0MEM, H1MEM, H2MEM, H3MEM, H4MEM, H5MEM FIFO memory (RAM) AMEM, BMEM Coefficient memory (RAM) CMEM, DMEM Data ROM SIN/COS LUT Microcode memory (RAM) ...
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FIFO Controller The FIFO controller handles the moving of data to and from the FIFOs, after being initially configured eight FIFOs can be created by the FIFO controller, four in A memory (AMEM) and four in B memory ...
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The structure of the PMEM address space is shown in Figure 6. Program Memory (RAM) (Mirror: 0x3000−0x3FFF) Memory Mapped Analog and Digital Registers Microcode Memory Program Memory (RAM) Program Memory (Boot ROM) 0x10000 0xF000 0xE000 0x8800 0x8000 0x4000 P Memory ...
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Other Digital Blocks and Functions General−Purpose Timer The CFX DSP system contains two general−purpose timers. These can be used for scheduling tasks that are not part of the sample−based signal−processing scheme, such as checking the battery voltage, and periodically asserting ...
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Analog Blocks Input Stage The analog audio input stage is comprised of four individual channels. For each channel, one input can be selected from any of the five possible input sources (depending on package option) and is then routed to ...
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... Figure 10. External Signal Routing of Connections for High−Power Output Mode The high−frequencies in the Class−D PDM output are filtered filter or by the frequency response of the speaker itself. ON Semiconductor recommends a 2−pole RC Our recommendations for components for the RC Filter are given below: For 8 KHz sampling, we recommend ...
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Power Supply Unit BelaSigna 300 has multiple power sources as can be seen on Figure 13. Digital and analog sections of the chip have their own power supplies to allow exceptional audio quality. Battery Supply Voltage (VBAT) The primary voltage ...
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... VDDC is not set by the boot ROM. Thus, care must be taken when using the DFN at high clock frequencies to ensure that the VDDC configuration is properly set. Contact ON Semiconductor for more information regarding VDDC calibration. External Digital Supply Voltage (VDDO) VDDO is an externally provided power source used by the pads of BelaSigna 300 ...
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Power Management Strategy BelaSigna 300 has a built−in power management unit that guarantees valid system operation under any voltage supply condition to prevent any unexpected audio output as the result of any supply irregularity. The unit constantly monitors the power ...
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Application Diagrams The application diagram of BelaSigna 300 (WLCSP Option) is shown in Figure 14. 2 AGND Preamplifiers Downsampling A/D A/D A/D AI4 A/D UART SPI Timer 1 Timer 2 Watchdog Timer CRC ...
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The application diagram of BelaSigna 300 (DFN Option) is shown in Figure 15. 2 − AGND Preamplifiers Downsampling A/D AI2 A/D AI3 A/D AI4 A/D SPI_CS SPI_CLK Optional SPI_SERI SPI EEPROM SPI_SERO ...
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... CARRIER DETAILS 2.6 x 3.8 mm WLCSP ON Semiconductor offers tape and reel packing for BelaSigna 300 WLCSP. The packing consists of a pocketed carrier tape, a cover tape, and a molded anti−static polystyrene reel. The carrier and cover tape create an ESD safe environment, protecting the components from physical and electrostatic damage during shipping and handling. ...
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... DFN ON Semiconductor offers tape and reel packing for BelaSigna 300 DFN. The packing consists of a pocketed carrier tape, a cover tape, and a molded anti−static polystyrene reel. The carrier and cover tape create an ESD safe environment, protecting the components from physical and electrostatic damage during shipping and handling. ...
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... B300W35A102XYG. To order BelaSigna 300 DFN, please contact your account manager and ask for part number B300D44A102XXG. Chip Identification Chip identification information can be retrieved by using the Communications Accelerator Adaptor (CAA) tool along with the protocol software provided by ON Semiconductor Figure 20 ...
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... 0. BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS WLCSP35, 3.63x2.68 CASE 567AG−01 ISSUE B A PIN A1 REFERENCE È È SEATING C PLANE RECOMMENDED ...
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... NOTE 3 M 0.26 44X *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...