EVX10AS150ATP ETC-unknow, EVX10AS150ATP Datasheet - Page 61

• Manufacturer Part Number: EVX10AS150ATP
• Description: Adc Single 2.5gsps 10-bit Lvds 317-pin Ebga
• Manufacturer: ETC-unknow

6. Package Description
6.1
Figure 6-1.
e2v semiconductors SAS 2009
A1 Corner
Ni Plated
A4
8
Package Outline
SIDE VIEW
DETAIL A
DETAIL A
EBGA 317 Package Outline
TOP VIEW
D
A2
ddd
5
A
E
C
B
A1
e
A
DETAIL B
DETAIL B
C
bbb
SEATING PLANE
Q
e
C
E1
27
26
25
24
6
23
Q
BOTTOM VIEW
22
21
20
19
18
b (Nx PLACES)
17
16
15
D1
14
13
12
0.30
0.15
11
10
9
8
7
6
5
4
3
2
M
M
4
1
A
C
E
G
J
L
N
R
U
W
C
C
V
B
D
F
H
K
M
P
T
A B
NOTES:
10. "A4" IS MEASURED AT THE EDGE OF ENCAPSULANT TO THE INNER EDGE
11. DIMENSIONING AND TOLERANCING PER ASME Y14.5 1994
12. THE OUTLINE DIMENSION IS REFERENCE TO JEDEC MS034.
13. FOR QUALIFICATION PURPOSE ONLY.
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. "e" REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
3. "MD" AND "ME" REPRESENTS THE BASIC SOLDER BALL MATRIX SIZE IN
4. DIMENSION "b" IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER
5.
6. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE
7. PACKAGE SURFACE SHALL BE Ni PLATED.
8. BLACK SPOT FOR PIN 1 IDENTIFICATION.
9. ENCAPSULANT SIZE MAY VARY WITH DIE SIZE.
OF BALL PAD.
"D" AND "E" DIRECTION RESPECTIVELY, AND SYMBOL "N" IS THE
MAXIMUM ALLOWABLE NUMBER OF BALLS AFTER DEPOPULATING.
PARALLEL TO PRIMARY DATUM C .
DIMENSION "ddd" IS MEASURED PARALLEL TO PRIMARY DATUM C .
REF.
SPHERICAL CROWNS OF THE SOLDER BALLS.
bbb
ddd
A2
A4
D
D1
E
E1
b
MD
ME
N
e
Q
A
A1
DIMENSIONAL REFERENCES
34.80
24.80
0.50
0.75
0.10
0.60
1.25
0.25
MIN.
33.02 (BSC.)
22.86 (BSC.)
1.27 TYP.
25.00
317
35.00
NOM.
0.60
0.85
0.75
1.45
27
19
EV10AS150A
0954B–BDC–12/09
35.20
25.20
1.65
0.90
0.20
MAX.
0.70
0.95
0.25
61