adg5213bcpz-rl7 Analog Devices, Inc., adg5213bcpz-rl7 Datasheet - Page 9

• Manufacturer Part Number: adg5213bcpz-rl7
• Description: High Voltage Latch-up Proof, Quad Spst Switches Adg5212/adg5213
• Manufacturer: Analog Devices, Inc.

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
Table 7. Pin Function Descriptions
TSSOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
N/A
1
Table 8. ADG5212 Truth Table
ADG5212 INx
1
0
Table 9. ADG5213 Truth Table
ADG5213 INx
0
1
N/A means not applicable.
1
Pin No.
LFCSP
15
16
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EP
Figure 2. TSSOP Pin Configuration
GND
V
IN1
IN4
D1
S1
S4
D4
SS
1
2
3
4
5
6
7
8
NC = NO CONNECT
ADG5212/
(Not to Scale)
ADG5213
TOP VIEW
Mnemonic
IN1
D1
S1
V
GND
S4
D4
IN4
IN3
D3
S3
NC
V
S2
D2
IN2
Exposed pad
SS
DD
16
15
14
13
12
11
10
9
IN2
D2
S2
V
NC
S3
D3
IN3
DD
S1, S4
Off
On
Description
Logic Control Input.
Drain Terminal. This pin can be an input or an output.
Source Terminal. This pin can be an input or an output.
Ground (0 V) Reference.
Source Terminal. This pin can be an input or an output.
Drain Terminal. This pin can be an input or an output.
Logic Control Input.
Logic Control Input.
Drain Terminal. This pin can be an input or an output.
Source Terminal. This pin can be an input or an output.
No Connect. These pins are open.
Source Terminal. This pin can be an input or an output.
Drain Terminal. This pin can be an input or an output.
Logic Control Input.
Most Negative Power Supply Potential.
Most Positive Power Supply Potential.
Exposed Pad. The exposed pad is connected internally. For increased reliability of the
solder joints and maximum thermal capability, it is recommended that the pad be
soldered to the substrate, V
Rev. 0 | Page 9 of 20
Switch Condition
On
Off
SS
.
NOTES
1. EXPOSED PAD TIED TO SUBSTRATE, V
2. NC = NO CONNECT.
GND
V
S1
S4
SS
Figure 3. LFCSP Pin Configuration
S2, S3
On
Off
1
2
3
4
(Not to Scale)
ADG5212/
ADG5213
TOP VIEW
ADG5212/ADG5213
12 S2
11 V
10 NC
9 S3
DD
SS
.