pip201-12m NXP Semiconductors, pip201-12m Datasheet - Page 17

• Manufacturer Part Number: pip201-12m
• Description: Pip201-12m-3 Dc-to-dc Converter Powertrain
• Manufacturer: NXP Semiconductors

Philips Semiconductors
9397 750 11942
Product data
Fig 20. PCB footprint for SOT687-1 package (reflow soldering).
11.15 OA
All dimensions in mm.
(2 )
7.6 Cu
(2 )
4.1
16.2 Solder paste printing
0.4 SP (2 )
e = 0.5
0.6 Cu
1 SP
(8 )
The process of printing the solder paste requires care because of the fine pitch and
small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The
stencil apertures can be made the same size as the solder lands in
The type of solder paste recommended for MLF packages is “No clean”, Type 3, due
to the difficulty of cleaning flux residues from beneath the MLF package.
1 SP
Rev. 03 — 19 November 2003
(8 )
0.4 SP
8.63 OA
0.6 Cu
(4 )
4.1
0.4 SP
(10 )
1 SP
MGW820
DC-to-DC converter powertrain
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
PIP201-12M-3
0.28 Cu (68 )
0.5 SP
(4 )
Figure
solder lands
Cu pattern
clearance
solder paste
occupied area
0.9 SP
(10 )
8.9 Cu
(2 )
20.
10.8 Cu
17 of 20
(2 )
0.1
0.2
0.02