sc16c852viet NXP Semiconductors, sc16c852viet Datasheet - Page 50

• Manufacturer Part Number: sc16c852viet
• Description: Sc16c852v 1.8 V Dual Uart, 5 Mbit/s Max. With 128-byte Fifos, Infrared Irda , And Xscale Vlio Bus Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
SC16C852V_4
Product data sheet
12.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 40.
Table 41.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 40
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
Dual UART with 128-byte FIFOs, IrDA, and XScale VLIO bus interface
41
24.
Rev. 04 — 14 January 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
24) than a SnPb process, thus
220
220
350
SC16C852V
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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