m36l0r7060t1 STMicroelectronics, m36l0r7060t1 Datasheet - Page 18

• Manufacturer Part Number: m36l0r7060t1
• Description: 128 Mbit Multiple Bank, Multilevel, Burst Flash Memory And 64 Mbit Burst Psram, 1.8 V Supply, Multichip Package
• Manufacturer: STMicroelectronics

Package mechanical
6
18/22
Package mechanical
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second-level interconnect. The category of
Second-Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 6.
1. Drawing is not to scale.
E
TFBGA88 8 × 10 mm, 8 × 10 ball array - 0.8 mm pitch, package outline
E2
E1
FE
BALL "A1"
FE1
SE
A
FD
D1
D
SD
A1
e
b
M36L0R7060T1, M36L0R7060B1
A2
BGA-Z42
ddd