FMS2007-000-EB FILTRONIC [Filtronic Compound Semiconductors], FMS2007-000-EB Datasheet - Page 3

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FMS2007-000-EB

Manufacturer Part Number
FMS2007-000-EB
Description
DC-6GHz DPDT Diversity Switch
Manufacturer
FILTRONIC [Filtronic Compound Semiconductors]
Datasheet
Pad and Die Layout:
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of the
bond pad opening
Die Size (µm)
897x929
Contact Details (UK):
Pad Number
Contact Details (USA): Tel: +1 (408) 850 5790
M
A
B
C
D
E
G
H
K
N
F
J
L
I
A
B
C
D
E
Die Thickness (µm)
Preliminary specifications subject to change without notice
Pad Name
Tel: +44 (0) 1325 301111 Fax: +44 (0) 1325 306177 Email: sales@filcs.com
ANT1
ANT2
GND
GND
GND
GND
GND
GND
V1
V3
RX
TX
V2
V4
150
Filtronic Compound Semiconductors Ltd
Preliminary Data Sheet
Website: www.filcs.com
N
F
Description
Antenna 1
Antenna 2
RX-Ant1
Transmit
RX-Ant2
TX-Ant2
Receive
Tx-Ant1
Ground
Ground
Ground
Ground
Ground
Ground
3
Fax: +1 (408) 850 5766
Min. Bond Pad
M
G
Pitch(µm)
127
2.2
Pin Coordinates
(x µm, y µm)
(142.1 , 709.0)
(142.1 , 581.6)
(142.1 , 448.5)
(142.1 , 201.4)
(769.2 , 201.4)
(769.2 , 327.9)
(769.2 , 448.5)
(769.2 , 581.6)
(769.2 , 709.0)
(522.2 , 807.7)
(349.8 , 807.7)
(142.1 ,327.9)
(349.8 , 88.5)
(522.2 , 88.5)
Email:
Min. Bond pad
L
H
K
J
I
sales@filcsi.com
opening (µm)
80x80
FMS2007

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