ADCMP606_0610 AD [Analog Devices], ADCMP606_0610 Datasheet - Page 14

• Manufacturer Part Number: ADCMP606_0610
• Description: Rail-to-Rail, Very Fast, 2.5 V to 5.5 V, Single-Supply CML Comparators
• Manufacturer: AD [Analog Devices]

ADCMP606/ADCMP607
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADCMP606BKSZ-R2
ADCMP606BKSZ-RL
ADCMP606BKSZ-REEL7
ADCMP607BCPZ-R2
ADCMP607BCPZ-R7
ADCMP607BCPZ-WP
1
Z = Pb-free part.
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
12° MAX
0.10 MAX
Figure 26. 6-Lead Thin Shrink Small Outline Transistor Package (SC70)
1.00
0.90
0.70
Figure 27. 12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
1.35
1.25
1.15
1.30 BSC
PIN 1
BSC SQ
VIEW
0.30
0.23
0.18
TOP
3.00
0.10 COPLANARITY
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-203-AB
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FOR EXPOSED PAD DIMENSION.
Package Description
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
12-Lead Lead Frame Chip Scale Package (LFCSP-VQ)
1
6
3 mm × 3 mm Body, Very Thin Quad
0.30
0.15
Dimensions shown in millimeters
Dimensions shown in millimeters
2.20
2.00
1.80
5
2
BSC SQ
0.20 REF
2.75
Rev. 0 | Page 14 of 16
4
3
0.65 BSC
0.05 MAX
0.02 NOM
(BOTTOM VIEW)
EXPOSED PAD
(CP-12-1)
SEATING
PLANE
1.10
0.80
(KS-6)
2.40
2.10
1.80
0.45
COPLANARITY
0.60 MAX
0.40
0.10
BSC
0.50
0.08
9
8
7
0.22
0.08
10
6
11
5
12
4
1
2
3
0.75
0.55
0.35
0.46
0.36
0.26
* 1.45
0.25 MIN
1.30 SQ
1.15
PIN 1
INDICATOR
Package
Option
KS-6
KS-6
KS-6
CP-12-1
CP-12-1
CP-12-1
Branding
G0S
G0S
G0S
G0H
G0H
G0H