M24C01 STMicroelectronics, M24C01 Datasheet

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M24C01

Manufacturer Part Number
M24C01
Description
16/8/4/2/1 Kbit Serial IC Bus EEPROM
Manufacturer
STMicroelectronics
Datasheet

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DESCRIPTION
These
programmable memory (EEPROM) devices are
organized as 2048/1024/512/256/128 x 8 bit
(M24C16, M24C08, M24C04, M24C02, M24C01),
and operate with a power supply down to 2.5 V (for
the -W version of each device), and down to 1.8 V
(for the -R version of each device).
The M24C16, M24C08, M24C04, M24C02,
M24C01 are available in Plastic Dual-in-Line,
Plastic Small Outline and Thin Shrink Small
Outline
available in a chip-scale (SBGA) package.
Table 1. Signal Names
May 2000
Two Wire I
Supports 400 kHz Protocol
Single Supply Voltage:
– 4.5V to 5.5V for M24Cxx
– 2.5V to 5.5V for M24Cxx-W
– 1.8V to 3.6V for M24Cxx-R
Hardware Write Control
BYTE and PAGE WRITE (up to 16 Bytes)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Programming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Behavior
1 Million Erase/Write Cycles (minimum)
40 Year Data Retention (minimum)
E0, E1, E2
SDA
SCL
WC
V
V
CC
SS
I
packages. The
2
C-compatible
2
C Serial Interface
Chip Enable Inputs
Serial Data/Address Input/
Output
Serial Clock
Write Control
Supply Voltage
Ground
electrically
M24C16-R
16/8/4/2/1 Kbit Serial I²C Bus EEPROM
erasable
is
also
M24C04, M24C02, M24C01
Figure 1. Logic Diagram
E0-E2
0.25 mm frame
8
TSSOP8 (DW)
8
SCL
PSDIP8 (BN)
169 mil width
WC
1
1
M24C16, M24C08
3
V CC
V SS
M24Cxx
SBGA5 (EA)
75 mil width
150 mil width
8
SO8 (MN)
SBGA
1
AI02033
SDA
1/20

Related parts for M24C01

M24C01 Summary of contents

Page 1

... V (for the -W version of each device), and down to 1.8 V (for the -R version of each device). The M24C16, M24C08, M24C04, M24C02, M24C01 are available in Plastic Dual-in-Line, Plastic Small Outline and Thin Shrink Small Outline packages. The M24C16-R available in a chip-scale (SBGA) package ...

Page 2

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 2A. DIP Connections 16Kb /8Kb Note Not Connected Figure 2B. SO Connections 16Kb /8Kb /4Kb Note Not Connected Figure 2C. Standard-TSSOP Connections 16Kb /8Kb Note Not Connected Figure 2D ...

Page 3

... Device Select Code and RW bit (as described in Table 3), terminated by an acknowledge bit. Figure 3. Maximum R Value versus Bus Capacitance ( M24C16, M24C08, M24C04, M24C02, M24C01 1 Parameter PSDIP8: 10 sec SO8: 40 sec TSSOP8: 40 sec SBGA5: t.b. When writing data to the memory, the memory inserts an acknowledge bit during the 9 following the bus master’ ...

Page 4

... M24C16, M24C08, M24C04, M24C02, M24C01 2 Figure Bus Protocol SCL SDA START CONDITION SCL MSB SDA START CONDITION 1 SCL MSB SDA disabled – the device will not respond to any command. In the same way, when V the operating voltage, below the POR threshold value, all operations are disabled and the device will not respond to any command ...

Page 5

... The memory Table 4. Operating Modes Mode Current Address Read Random Address Read Sequential Read Byte Write Page Write Note M24C16, M24C08, M24C04, M24C02, M24C01 1 Device Type Identifier ...

Page 6

... A9, and E2 is not available for devices that need to use address line A10 (see Figure 2A to Figure 2D and Table 3 for details). Using the E0, E1 and E2 inputs pins eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 device can be connected to one I the hybrid cases, this gives a total memory ...

Page 7

... Device Select Code with the RW bit set to ’0’, as shown in Table 4. The memory acknowledges this, and waits for an address byte. The memory responds to the address byte with an acknowledge bit, and then waits for the data byte. M24C16, M24C08, M24C04, M24C02, M24C01 ACK ACK BYTE ADDR DATA IN ...

Page 8

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 7. Write Cycle Polling Flowchart using ACK First byte of instruction with already decoded by M24xxx NO ReSTART STOP are all located in the same ’row’ in the memory: that is the most significant memory address bits are the same. If more bytes are sent than will fit up to the end of the row, a condition known as ‘ ...

Page 9

... Ack, indicating that the memory is ready to receive the second part of the next instruction (the first byte of this instruction having been sent during Step 1). M24C16, M24C08, M24C04, M24C02, M24C01 ACK NO ACK DEV SEL DATA OUT ...

Page 10

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 5A. DC Characteristics ( °C, or – ° °C, or – ° Symbol Parameter Input Leakage Current I LI (SCL, SDA) I Output Leakage Current LO -W series: I Supply Current CC -R series: Supply Current ...

Page 11

... M24C16, M24C08, M24C04, M24C02, M24C01 1 Test Condition OUT =5V time < 30ns mA M24C16, M24C08, M24C04, M24C02, M24C01 V =4 70° –40 to 85°C Min Max 300 300 20 300 20 300 600 600 600 0 1 ...

Page 12

... Input Impedance WCL Z WC Input Impedance WCH t Pulse width ignored NS (Input Filter on SCL and SDA) Note: 1. Sampled only, not 100% tested. 12/20 4 M24C16, M24C08, M24C04, M24C02, M24C01 Parameter Figure 9. AC Testing Input Output Waveforms 50 ns 0.8V CC 0. 0.2V CC 0. ° 400 kHz) ...

Page 13

... Figure 10. AC Waveforms SCL SDA IN START CONDITION SCL tCLQV SDA OUT SCL SDA IN tCHDH STOP CONDITION M24C16, M24C08, M24C04, M24C02, M24C01 tCHCL tDLCL tCHDX tCLDX SDA SDA INPUT CHANGE tCLQX DATA VALID DATA OUTPUT tW WRITE CYCLE tCLCH tDXCX tCHDH tDHDL STOP & ...

Page 14

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 9. Ordering Information Scheme Example: M24C08 Memory Capacity 16 16 Kbit (2048 Kbit (1024 Kbit (512 Kbit (256 Kbit (128 x 8) Operating Voltage blank 5 Note: 1. Temperature range 1 available only on request. 2. SBGA5 package available only for the “ ...

Page 15

... Table 10. PSDIP8 - 8 pin Plastic Skinny DIP, 0.25mm lead frame Symb. Typ 7. 2. Figure 11. PSDIP8 (BN) B Note: 1. Drawing is not to scale. M24C16, M24C08, M24C04, M24C02, M24C01 mm Min. Max. 3.90 5.90 0.49 – 3.30 5.30 0.36 0.56 1.15 1.65 0.20 0.36 9.20 9.90 – – 6.00 6.70 – – 7.80 – 10.00 3.00 3. ...

Page 16

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 11. SO8 - 8 lead Plastic Small Outline, 150 mils body width Symb. Typ 1. Figure 12. SO8 narrow (MN SO-a Note: 1. Drawing is not to scale. 16/20 mm Min. Max. 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 – – 5.80 6.20 0.25 0.50 0.40 0.90 0° 8° inches Typ ...

Page 17

... Table 12. TSSOP8 - 8 lead Thin Shrink Small Outline Symb. Typ 0. Figure 13. TSSOP8 (DW Note: 1. Drawing is not to scale. M24C16, M24C08, M24C04, M24C02, M24C01 mm Min. Max. 1.10 0.05 0.15 0.85 0.95 0.19 0.30 0.09 0.20 2.90 3.10 6.25 6.50 4.30 4.50 – – 0.50 0.70 0° 8° inches Typ. Min. 0.002 ...

Page 18

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 13. SBGA5 - 5 ball Shell Ball Grid Array Symb. Typ. A 0.430 A1 0.180 D 1.900 D1 1.190 E 1.750 E1 1.070 e 0.800 ball diameter 0.350 N Figure 14. SBGA5 (EA) – Underside view (ball side) Note: 1. Drawing is not to scale. 18/20 mm Min. Max. 0.380 0.480 0.150 0.210 1 ...

Page 19

... Date TSSOP8 Turned-Die package removed (p 2 and order information) 10-Dec-1999 Lead temperature added for TSSOP8 in table 2 18-Apr-2000 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13 05-May-2000 Extra labelling to Fig-2D M24C16, M24C08, M24C04, M24C02, M24C01 Description of Revision 19/20 ...

Page 20

... M24C16, M24C08, M24C04, M24C02, M24C01 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

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