GS820E32T GSI Technology, GS820E32T Datasheet - Page 21

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GS820E32T

Manufacturer Part Number
GS820E32T
Description
64K x 32 / 2M Synchronous Burst SRAM
Manufacturer
GSI Technology
Datasheet
Rev: 1.03 2/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
TQFPand QFP Package Drawing
Notes:
1.
2.
Symbol
A1
A2
D1
E1
L1
All dimensions are in millimeters (mm).
Package width and length do not include mold protrusion
D
E
Y
b
c
e
L
L1
A1
Terminal Dimension
Terminal Dimension
L
e
b
Body Thickness
Lead Thickness
Package Body
Package Body
Description
Lead Length
Foot Length
Lead Width
Coplanarity
Lead Angle
Lead Pitch
Standoff
A2
c
21/23
Min.
0.05
1.35
0.20
0.09
21.9
19.9
15.9
13.9
0.45
0
TQFP
Nom.
0.10
1.40
0.30
22.0
20.0
16.0
14.0
0.65
0.60
1.00
E1
E
Max
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
0.75
0.10
7
GS820E32T/Q-150/138/133/117/100/66
22.95
Min.
0.25
2.55
0.20
0.10
19.9
17.0
13.9
.60
0
Nom.
QFP
0.35
2.72
0.30
0.15
23.2
20.0
17.2
14.0
0.65
0.80
1.60
© 1999, Giga Semiconductor, Inc.
23.45
Max
0.45
2.90
0.40
0.20
20.1
17.4
14.1
1.00
0.10
7
D

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