MAX11666AUB+ Maxim Integrated, MAX11666AUB+ Datasheet - Page 2

• Manufacturer Part Number: MAX11666AUB+
• Description: Analog to Digital Converters - ADC 1/2Ch 12-Bit 500ksps Low Power SPI
• Manufacturer: Maxim Integrated

Specifications of MAX11666AUB+

• Rohs: yes
• Number Of Channels: 2
• Architecture: SAR
• Conversion Rate: 500 KSPs
• Resolution: 12 bit
• Input Type: Single-Ended
• Interface Type: SPI
• Operating Supply Voltage: 2.2 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: uMAX-10
• Maximum Power Dissipation: 707.3 mW
• Minimum Operating Temperature: - 40 C
• Number Of Converters: 1
• Voltage Reference: 2.2 V to 3.6 V

ELECTRICAL CHARACTERISTICS (MAX11666)
(V
unless otherwise noted. Typical values are at T
500ksps, Low-Power,
Serial 12-/10-/8-Bit ADCs
ABSOLUTE MAXIMUM RATINGS
V
REF, OVDD, AIN1, AIN2, AIN to GND ........-0.3V to the lower of
CS, SCLK, CHSEL, DOUT TO GND ............-0.3V to the lower of
AGND to GND ......................................................-0.3V to +0.3V
Input/Output Current (all pins) ...........................................50mA
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
DD
DC ACCURACY
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Total Unadjusted Error
Channel-to-Channel Offset
Matching
Channel-to-Channel Gain
Matching
DYNAMIC PERFORMANCE (f
Signal-to-Noise and Distortion
Signal-to-Noise Ratio
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
Small-Signal Bandwidth
Crosstalk
DD
______________________________________________________________________________________
to GND .............................................................-0.3V to +4V
= 2.2V to 3.6V, V
PARAMETER
REF
= V
DD
AIN
, V
OVDD
= 250kHz)
SYMBOL
(V
SINAD
SFDR
OVDD
DNL
SNR
THD
TUE
IMD
INL
OE
GE
(V
= V
DD
+ 0.3V) and +4V
DD
+ 0.3V) and +4V
A
. f
= +25NC.) (Note 1)
No missing codes
Excluding offset and reference errors
f
-3dB point
SINAD > 68dB
1
SCLK
= 239.8kHz, f
= 8MHz, 50% duty cycle, 500ksps. C
2
CONDITIONS
= 200.2kHz
Continuous Power Dissipation (T
Operating Temperature Range ....................... .-40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
6-Pin SOT23 (derate 8.7mW/NC above +70NC) ...........696mW
10-Pin FMAX (derate 8.8mW/NC above +70NC)........707.3mW
DOUT
70.5
75.5
MIN
12
70
= 10pF, T
A
= +70NC)
Q0.05
TYP
Q0.3
Q0.4
72.5
-85
-84
2.5
-90
Q1
Q1
72
85
40
45
A
= -40NC to +125NC,
MAX
-74.5
Q1
Q1
Q4
Q3
UNITS
MHz
MHz
MHz
LSB
LSB
LSB
LSB
LSB
LSB
LSB
Bits
dB
dB
dB
dB
dB
dB