CY7C1360C-200AJXC Cypress Semiconductor Corp, CY7C1360C-200AJXC Datasheet - Page 11

IC SRAM 9MBIT 200MHZ 100LQFP

CY7C1360C-200AJXC

Manufacturer Part Number
CY7C1360C-200AJXC
Description
IC SRAM 9MBIT 200MHZ 100LQFP
Manufacturer
Cypress Semiconductor Corp
Type
Synchronousr
Datasheet

Specifications of CY7C1360C-200AJXC

Memory Size
9M (256K x 36)
Package / Case
100-LQFP
Format - Memory
RAM
Memory Type
SRAM - Synchronous
Speed
200MHz
Interface
Parallel
Voltage - Supply
3.135 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Access Time
3 ns
Maximum Clock Frequency
200 MHz
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3.135 V
Maximum Operating Current
220 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Number Of Ports
4
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
428-2125
CY7C1360C-200AJXC

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1360C-200AJXC
Manufacturer:
CYPRESS
Quantity:
11
Part Number:
CY7C1360C-200AJXC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Company:
Part Number:
CY7C1360C-200AJXC
Quantity:
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Part Number:
CY7C1360C-200AJXCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Truth Table
The Truth Table for CY7C1360C and CY7C1362C follows.
Document Number: 38-05540 Rev. *K
Deselect cycle, power-down
Deselect cycle, power-down
Deselect cycle, power-down
Deselect cycle, power-down
Deselect cycle, power-down
Sleep mode, power-down
READ cycle, begin burst
READ cycle, begin burst
WRITE cycle, begin burst
READ cycle, begin burst
READ cycle, begin burst
READ cycle, continue burst
READ cycle, continue burst
READ cycle, continue burst
READ cycle, continue burst
WRITE cycle, continue burst
WRITE cycle, continue burst
READ cycle, suspend burst
READ cycle, suspend burst
READ cycle, suspend burst
READ cycle, suspend burst
WRITE cycle, suspend burst
WRITE cycle, suspend burst
Notes
6. X = “Don't Care.” H = Logic HIGH, L = Logic LOW.
7. WRITE = L when any one or more byte write enable signals and BWE = L or GW = L. WRITE = H when all byte write enable signals, BWE, GW = H.
8. The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
9. CE
10. The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BW
11. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-State when OE is
after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the Write cycle to allow the outputs to tri-state. OE is a
don't care for the remainder of the write cycle.
inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).
1
, CE
Operation
2
, and CE
3
are available only in the TQFP package. BGA package has only two chip selects CE
Address
External
External
External
External
External
Current
Current
Current
Current
Current
Current
Used
None
None
None
None
None
None
Next
Next
Next
Next
Next
Next
CE
H
X
X
X
H
H
X
H
X
X
H
H
X
H
L
L
L
L
L
L
L
L
L
1
CE
H
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
L
L
2
[6, 7, 8, 9, 10, 11]
CE
H
H
X
X
X
X
L
L
L
X
X
X
X
X
X
X
X
X
X
X
X
L
L
3
ZZ ADSP ADSC ADV WRITE OE CLK
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
H
X
H
H
X
H
H
H
H
X
X
X
H
H
X
X
X
L
L
L
L
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
L
X
X
L
L
L
L
L
1
and CE
H
H
H
H
X
X
X
X
X
X
X
X
X
X
X
H
H
L
L
L
L
L
L
X
. Writes may occur only on subsequent clocks
CY7C1360C, CY7C1362C
2
.
H
H
H
H
H
H
H
H
H
H
X
X
X
X
X
X
X
X
L
L
L
L
L
H
H
H
H
H
H
X
X
X
X
X
X
L
X
L
L
L
X
X
L
L
X
X
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
L-H
X
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Tri-state
Page 11 of 34
DQ
Q
Q
Q
Q
Q
Q
D
D
D
D
D
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