W25X40BVSSIG Winbond Electronics, W25X40BVSSIG Datasheet - Page 3

• Manufacturer Part Number: W25X40BVSSIG
• Description: IC SPI FLASH 4MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X40BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.
11.
12.
REVISION HISTORY ............................................................................................................................ 51
ELECTRICAL CHARACTERISTICS
10.1
10.2
10.3
10.4
10.5
10.6
10.7
10.8
10.9
10.10
PACKAGE SPECIFICATION
11.1
11.2
11.3
11.4
ORDERING INFORMATION
12.1
9.2.9
9.2.10
9.2.11
9.2.12
9.2.13
9.2.14
9.2.15
9.2.16
9.2.17
9.2.18
9.2.19
9.2.20
9.2.21
9.2.22
9.2.23
Absolute Maximum Ratings
Operating Ranges
Power-up Timing and Write Inhibit Threshold
DC Electrical Characteristics
AC Measurement Conditions
AC Electrical Characteristics
AC Electrical Characteristics (cont’d)
Serial Output Timing
Input Timing
8-Pin SOIC 150-mil (Package Code SN)
8-Pin SOIC 208-mil (Package Code SS)
8-Pin PDIP 300-mil (Package Code DA)
8-Contact 6x5mm WSON (Package Code ZP)
Valid Part Numbers and Top Side Marking
Hold Timing
Fast Read Dual Output (3Bh)
Fast Read Dual I/O (BBh)
Continuous Read Mode Bits (M7-0)
Continuous Read Mode Reset (FFFFh)
Page Program (02h)
Sector Erase (20h)
32KB Block Erase (52h)
Block Erase (D8h)
Chip Erase (C7h or 60h)
Power-down (B9h)
Release Power-down / Device ID (ABh)
Read Manufacturer / Device ID (90h)
Read Manufacturer / Device ID Dual I/O (92h)
Read Unique ID Number (4Bh)
JEDEC ID (9Fh)
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W25X10BV/20BV/40BV
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Publication Release Date: August 20, 2009
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Preliminary -- Revision B