W25X40BVSSIG Winbond Electronics, W25X40BVSSIG Datasheet - Page 40

• Manufacturer Part Number: W25X40BVSSIG
• Description: IC SPI FLASH 4MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X40BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10.5 AC Measurement Conditions
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
PARAMETER
Load Capacitance
Input Rise and Fall Times
Input Pulse Voltages
Input Timing Reference Voltages
Output Timing Reference Voltages
Figure 26. AC Measurement I/O Waveform
SYMBOL
- 40 -
T
O
R
V
C
IN
, T
UT
IN
L
F
W25X10BV/20BV/40BV
MIN
0.2 VCC to 0.8 VCC
0.3 VCC to 0.7 VCC
0.5 VCC to 0.5 VCC
SPEC
MAX
30
5
UNIT
pF
ns
V
V
V