W25X40BVSSIG Winbond Electronics, W25X40BVSSIG Datasheet - Page 49

• Manufacturer Part Number: W25X40BVSSIG
• Description: IC SPI FLASH 4MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X40BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Notes:
12. ORDERING INFORMATION
1a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel
1b. The “W” prefix is not included on the part marking.
2. Only the 2
W = Winbond
25X = spiFlash Serial Flash Memory with 4KB sectors, Dual Outputs
40 = 4M-bit
20 = 2M-bit
10 = 1M-bit
V = 2.7V to 3.6V
SN = 8-pin SOIC 150-mil
SS = 8 pin SOIC 208-mil
G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb
I = Industrial (-40°C to +85°C)
(shape T) or Tray (shape S), when placing orders.
nd
letter is used for the part marking, package type ZP is not used for the part marking.
DA = 8-pin PDIP 300mil
ZP = 8-pad WSON 6x5mm
(1)
- 49 -
W 25X xxB V xx
W25X10BV/20BV/40BV
Publication Release Date: August 20, 2009
Preliminary -- Revision B
2
O
3
)
(2)