NCP5030MTTXG ON Semiconductor, NCP5030MTTXG Datasheet - Page 14

• Manufacturer Part Number: NCP5030MTTXG
• Description: IC LED DRIVR HIGH BRIGHT 12-WDFN
• Manufacturer: ON Semiconductor
• Type: HBLED Driverr

Specifications of NCP5030MTTXG

• Constant Current: Yes
• Topology: PWM, Step-Down (Buck), Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Primary: Flash/Torch
• Type - Secondary: White LED
• Frequency: 600kHz ~ 800kHz
• Voltage - Supply: 2.7 V ~ 5.5 V
• Voltage - Output: 2.2 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 12-VFDFN Exposed Pad
• Operating Temperature: -40°C ~ 85°C
• Current - Output / Channel: 900mA
• Internal Switch(s): Yes
• Efficiency: 87%
• Operating Supply Voltage (typ): 3.3/5V
• Number Of Segments: 1
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: WDFN
• Pin Count: 12
• Mounting: Surface Mount
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Supply Current: 5 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP5030MTTXG; NCP5030MTTXGOSTR

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12X
2X
INDEX AREA
0.10
0.08
2X
12X
0.10
12X
PIN 1
0.10
K
C
C
L
C
È È È È
È È È È
È È È È
C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
12
1
BOTTOM VIEW
e
SIDE VIEW
TOP VIEW
D2
D
6
7
A3
b
12X
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
A1
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
A
E2
0.10
0.05
B
E
WDFN12, 3x4, 0.5P
http://onsemi.com
CASE 506AY−01
C
C
NOTE 3
A
ISSUE B
C
A
B
14
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
3.35
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
e
K
L
MILLIMETERS
MIN
0.70
0.00
0.20
3.20
1.60
0.20
0.30
0.20 REF
4.00 BSC
3.00 BSC
0.50 BSC
3.30
1.75
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MAX
0.80
0.05
0.30
3.40
1.80
0.50
−−−
DIMENSIONS: MILLIMETERS
0.50 PITCH
12 X
0.55
NCP5030/D
0.30
12 X