SI8235BB-C-IS1 Silicon Laboratories Inc, SI8235BB-C-IS1 Datasheet - Page 12

• Manufacturer Part Number: SI8235BB-C-IS1
• Description: IC DUAL LOW SIDE DRIVER 16SOIC
• Manufacturer: Silicon Laboratories Inc

Specifications of SI8235BB-C-IS1

• Package / Case: 16-SOIC (3.9mm Width)
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 60ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 6.5 V ~ 24 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Number Of Channels: 2
• Propagation Delay Time: 30 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Power Dissipation: 1.2 W
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Driver Configuration: Non-Inverting
• Input Logic Level: TTL
• Rise Time: 12ns
• Fall Time: 12ns
• Frequency (max): 8MHz
• Operating Supply Voltage (max): 5.5/24V
• Peak Output Current: 4A
• Output Resistance: 2.7Ohm
• Operating Supply Voltage (min): 4.5/6.5V
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1898-5

Si823x
Table 4. Insulation and Safety-Related Specifications
Table 5. IEC 60664-1 (VDE 0884 Part 2) Ratings
12
Parameter
Nominal Air Gap
(Clearance)
Nominal External Tracking
(Creepage)
Minimum Internal Gap
(Internal Clearance)
Tracking Resistance
(Proof Tracking Index)
Erosion Depth
Resistance
(Input-Output)
Capacitance
(Input-Output)
Input Capacitance
Notes:
Parameter
Basic Isolation Group
Installation Classification
1. The values in this table correspond to the nominal creepage and clearance values as detailed in “7. Package Outline:
2. To determine resistance and capacitance, the Si823x is converted into a 2-terminal device. Pins 1–8 (1-7, 14 LD LGA)
3. Measured from input pin to ground.
16-Pin Wide Body SOIC” , “9. Package Outline: 16-Pin Narrow Body SOIC” , “11. Package Outline: 14 LD LGA
(5 x 5 mm)” , and “13. Package Outline: 14 LD LGA with Thermal Pad (5 x 5 mm)” . VDE certifies the clearance and
creepage limits as 4.7 mm minimum for the NB SOIC-16 and 8.5 mm minimum for the WB SOIC-16 package. UL does
not impose a clearance and creepage minimum for component level certifications. CSA certifies the clearance and
creepage limits as 3.9 mm minimum for the NB SOIC 16 and 7.6 mm minimum for the WB SOIC-16 package.
are shorted together to form the first terminal and pins 9–16 (8-14, 14 LD LGA) are shorted together to form the second
terminal. The parameters are then measured between these two terminals.
1
1
2
2
3
Symbol
L(1O1)
L(1O2)
Material Group
Rated Mains Voltages < 150 V
Rated Mains Voltages < 300 V
Rated Mains Voltages < 400 V
Rated Mains Voltages < 600 V
PTI
R
C
ED
C
IO
IO
I
Test Conditions
Condition
IEC60112
f = 1 MHz
Test
Rev. 1.1
WBSOIC-16
5 kV
0.014
0.040
10
600
8.0
8.0
1.4
4.0
RMS
RMS
RMS
RMS
RMS
12
WBSOIC-16
NBSOIC-16
SOIC-16
2.5 kV
8.0/4.01
8.0/4.01
WB
0.014
0.019
I-IV
I-IV
I-III
I-III
10
600
1.4
4.0
I
12
RMS
Value
SOIC-16
2.5 kV
NB
I-IV
I-III
Specification
I-II
I-II
I
14 LD
0.014
0.021
LGA
10
600
3.5
3.5
1.4
4.0
12
RMS
14 LD
LGA
I-IV
I-III
I-II
I-II
1.5 kV
I
LGA w/
14 LD
0.014
0.021
1.75
1.75
10
Pad
600
1.4
4.0
12
RMS
w/ Pad
14 LD
LGA
I-IV
I-III
I-II
I-I
I
Unit
mm
mm
mm
mm
pF
pF

V