SI8235BB-C-IS1 Silicon Laboratories Inc, SI8235BB-C-IS1 Datasheet - Page 46

• Manufacturer Part Number: SI8235BB-C-IS1
• Description: IC DUAL LOW SIDE DRIVER 16SOIC
• Manufacturer: Silicon Laboratories Inc

Specifications of SI8235BB-C-IS1

• Package / Case: 16-SOIC (3.9mm Width)
• Configuration: Low-Side
• Input Type: Non-Inverting
• Delay Time: 60ns
• Current - Peak: 4A
• Number Of Configurations: 2
• Number Of Outputs: 2
• Voltage - Supply: 6.5 V ~ 24 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Number Of Channels: 2
• Propagation Delay Time: 30 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Supply Current: 2 mA
• Power Dissipation: 1.2 W
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Drivers: 2
• Driver Configuration: Non-Inverting
• Input Logic Level: TTL
• Rise Time: 12ns
• Fall Time: 12ns
• Frequency (max): 8MHz
• Operating Supply Voltage (max): 5.5/24V
• Peak Output Current: 4A
• Output Resistance: 2.7Ohm
• Operating Supply Voltage (min): 4.5/6.5V
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• High Side Voltage - Max (bootstrap): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1898-5

Si823x
14. Land Pattern: 14 LD LGA with Thermal Pad
Figure 51 illustrates the recommended land pattern details for the Si8236 in a 14-pin LGA with thermal pad.
Table 25 lists the values for the dimensions shown in the illustration.
46
Table 25. 14-Pin LGA with Thermal Pad Land Pattern Dimensions
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm).
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least
4. All metal pads are to be non-solder mask defined (NSMD). Clearance
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1.
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 51. 14-Pin LGA with Thermal Pad Land Pattern
Material Condition (LMC) is calculated based on a Fabrication
Allowance of 0.05 mm.
between the solder mask and the metal pad is to be 60 µm minimum, all
the way around the pad.
walls should be used to assure good solder paste release.
specification for Small Body Components.
Dimension
C1
C2
D2
X1
Y1
E
Rev. 1.1
(mm)
4.20
1.50
4.25
0.65
0.80
0.40