ISL97644IRZ-TK Intersil, ISL97644IRZ-TK Datasheet - Page 14

• Manufacturer Part Number: ISL97644IRZ-TK
• Description: IC REG BOOST LDO VON VCOM 24-QFN
• Manufacturer: Intersil

Specifications of ISL97644IRZ-TK

• Applications: LCD Monitor, Notebook Display
• Current - Supply: 1mA
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Layout Recommendation
The device’s performance including efficiency, output noise,
transient response and control loop stability is dramatically
affected by the PCB layout. PCB layout is critical, especially
at high switching frequency.
There are some general guidelines for layout:
A demo board is available to illustrate the proper layout
implementation.
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notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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1. Place the external power components (the input
2. Place V
3. Reduce the loop area with large AC amplitudes and fast
4. The feedback network should sense the output voltage
5. The power ground (PGND) and signal ground (SGND)
6. The exposed die plate, on the underneath of the
7. To minimize the thermal resistance of the package when
8. A signal ground plane, separate from the power ground
9. Minimize feedback input track lengths to avoid switching
capacitors, output capacitors, boost inductor and output
diodes, etc.) in close proximity to the device. Traces to
these components should be kept as short and wide as
possible to minimize parasitic inductance and resistance.
slew rate.
directly from the point of load, and be as far away from LX
node as possible.
pins should be connected at only one point.
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for control circuit.
noise pick-up.
IN
and VDD bypass capacitors close to the pins.
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
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ISL97644
December 14, 2007
FN9228.1