SA56004EDP,118 NXP Semiconductors, SA56004EDP,118 Datasheet - Page 30

• Manufacturer Part Number: SA56004EDP,118
• Description: IC TEMP SENSOR 8-TSSOP
• Manufacturer: NXP Semiconductors

Specifications of SA56004EDP,118

• Package / Case: 8-TSSOP
• Output Type: I²C™/SMBus™
• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Multiplexer, Register Bank
• Sensor Type: External & Internal
• Sensing Temperature: -40°C ~ 125°C, External Sensor
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Current: 1 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-3615 - DEMO BOARD I2C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3338-2; 935274567118; SA56004EDP-T

NXP Semiconductors
13. Packing information
14. Soldering of SMD packages
SA56004X_5
Product data sheet
14.1 Introduction to soldering
14.2 Wave and reflow soldering
The SA56004X is packed in reels, as shown in
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description” .
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
guard band
Fig 23. Tape and reel packing method
•
•
barcode label
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
box
tape
Rev. 05 — 22 May 2008
Digital temperature sensor with overtemperature alarms
reel assembly
Figure
23.
tape detail
SA56004X
© NXP B.V. 2008. All rights reserved.
cover tape
carrier tape
002aad226
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