NCP4200MNR2G ON Semiconductor, NCP4200MNR2G Datasheet - Page 4

• Manufacturer Part Number: NCP4200MNR2G
• Description: IC CONV SYNC BUCK PMBUS 40QFN
• Manufacturer: ON Semiconductor

Specifications of NCP4200MNR2G

• Applications: Converter, Intel VR11, VR11.1
• Voltage - Input: 1.7 ~ 24 V
• Number Of Outputs: 1
• Voltage - Output: 0.375 ~ 1.8 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 40-VFQFN Exposed Pad
• Output Voltage: 0.375 V to 1.6 V
• Output Current: 500 uA
• Input Voltage: 1.7 V to 24 V
• Switching Frequency: 0.25 MHz to 6 MHz
• Operating Temperature Range: 0 C to + 85 C
• Mounting Style: SMD/SMT
• Duty Cycle (max): 100 %
• Isolated/non-isolated: Non Isolated
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to Electrical Characteristics and Application Information for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
3. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
4. Values based on copper area of 645 mm
5. Minimum V
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
OPERATING RANGES
Input Voltage Range (Note 1)
FBRTN
PWM2 to PWM4, RAMPADJ
SW1 to SW4
SW1 to SW4 (< 200 ns)
All Other Inputs and Outputs
Storage Temperature Range
Operating Ambient Temperature Range
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Body Model (Note 2)
Lead Temperature Soldering
Thermal Characteristics; QFN, 6mm x 6mm (Note 1)
Input Voltage (Note 5)
Output Voltage (Adjustable Version Only)
Ambient Temperature
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating: ≤150 mA per JEDEC standard: JESD78
Re−flow (SMD Styles Only, Pb−Free Versions (Note 3)
Thermal Resistance, Junction−to−Air (Note 4)
IN
= 1.7 V or (V
(Note 1)
Parameter
Parameter
Parameter
OUT
+ V
DO
), whichever is higher. Maximum Limit for V
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate.
http://onsemi.com
4
ESD
Symbol
Symbol
Symbol
V
ESD
V
T
T
R
FBRTN
V
V
STG
OUT
T
SLD
qJA
IN
IN
A
HBM
MM
OUT
= V
OUT(NOM)
0.375
Min
1.7
0
−0.3 to V
−0.3 to V
−65 to +150
−0.3 to 6.0
−0.3 to 0.3
−10 to +25
−10 to 100
−5 to +25
– 10%.
Value
Value
100
260
27
2
IN
IN
+ 0.3
+0.3
Max
1.8
24
85
°C/W
Unit
Unit
Unit
°C
°C
kV
°C
°C
V
V
V
V
V
V
V
V
V