IDT89HPES12T3G2ZABCG8 IDT, Integrated Device Technology Inc, IDT89HPES12T3G2ZABCG8 Datasheet - Page 15

• Manufacturer Part Number: IDT89HPES12T3G2ZABCG8
• Description: IC PCI SW 12LANE 3PORT 324-BGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES12T3G2ZABCG8

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 89HPES12T3G2ZABCG8

Thermal Considerations
Power Consumption
(and also listed below).
Table 13 (and also listed below).
that is relevant to the thermal performance of the PES12T3G2 switch.
IDT 89HPES12T3G2 Data Sheet
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
This section describes thermal considerations for the PES12T3G2 (19mm
Number of active
(Full swing)
(Full swing)
Lanes per Port
4/4/4
4/1/1
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 17. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 17), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JC
JB
θ
JA
Watts
Watts
= (T
mA
mA
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
1.0V
Core Supply
Typ
0.53
0.44
531
440
- T
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
J(max)
Table 17 Thermal Specifications for PES12T3G2, 19x19 mm CABGA324 Package
Power Dissipation of the Device
)/P
1.1V
Max
Junction Temperature
Ambient Temperature
, T
0.86
0.61
781
550
Parameter
A(max)
, and P are known, the value of desired
1.0V
PCIe Analog
Typ
0.40
0.32
402
320
Supply
Table 16 PES12T3G2 Power Consumption
1.1V
Max
0.53
0.39
484
352
15 of 30
2.5V
PCIe Analog
High Supply
Typ
0.39
0.28
155
110
θ
2
CS
Value
CABGA324 package). The data in Table 17 below contains information
2.75V
23.6
16.8
15.4
14.5
Max
125
), that of the heat sink (
7.6
2.3
0.61
0.36
70
220
132
θ
1.0V
Typ
JA
PCIe Termin-
0.23
0.12
ation Supply
230
120
becomes a known entity to the system designer. How to
Units
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
o
o
C
C
θ
1.1V
Max
JA
0.29
0.14
264
130
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
3.3V
Typ
0.01
.01
I/O Supply
3
3
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
Maximum
3.465V
Max
0.02
.02
4
4
September 13, 2010
Power
Typ
1.56
1.16
J(max)
θ
Total
JC
(value
value
Power
Max
1.51
2.3