SOIC8EV Microchip Technology, SOIC8EV Datasheet - Page 16

• Manufacturer Part Number: SOIC8EV
• Description: BOARD DEMO 8SOIC/MSOP/TSSOP/DIP
• Manufacturer: Microchip Technology

Specifications of SOIC8EV

• Mfg Application Notes: Interface Product Design Guide
• Main Purpose: Bare Evaluation Board
• Embedded: No
• Primary Attributes: 8- Pin SOIC/DIP/TSSOP/MSOP Evaluation Board
• Secondary Attributes: For PICmicro® MCUs, ADCs, DACs and other Devices
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Utilized Ic / Part: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User’s Guide
2.4
DS51544A-page 12
8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-3.
2.4.1
The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad.
These pads can have connection posts installed that allows easy connection to the
power (V
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to R2X and ground plane to R3X and C1X).
2.4.2
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (V
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane, so when power is
connected to the VDD and VSS pads, the power is connected to the appropriate device
pin.
FIGURE 2-3:
Revision 1 of this PCB has an issue that these vias are not connected to the desired
power and ground planes (they are open). For additional information, refer to
Appendix D. “Rev. 1 PCB Errata”.
Jumpering to VSS
DD
Power and Ground
PCB PADs
) and ground (V
Jumpering the PCB pad to either VDD or VSS.
DD
SS
) and some ground pins (V
) planes. The layout allows either through-hole or
Jumpering to VDD
SS
). To ease connections on the
© 2005 Microchip Technology Inc.