NCP3065SOBSTGEVB ON Semiconductor, NCP3065SOBSTGEVB Datasheet - Page 3

• Manufacturer Part Number: NCP3065SOBSTGEVB
• Description: EVAL BOARD FOR NCP3065SOBSTG
• Manufacturer: ON Semiconductor

Specifications of NCP3065SOBSTGEVB

• Design Resources: NCP3065 Boost Eval Board BOM NCP3065SOBSTGEVB Gerber Files NCP3065 Boost Eval Board Schematic
• Current - Output / Channel: 350mA
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 20 V
• Voltage - Input: 12V
• Utilized Ic / Part: NCP3065
• Core Chip: NCP3065
• Topology: Buck-Boost
• No. Of Outputs: 1
• Dimming Control Type: PWM
• Development Tool Type: Hardware - Eval/Demo Board
• Leaded Process Compatible: Yes
• Mcu Supported Families: NCP3065
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: NCP3065SOBSTG
• Other names: NCP3065SOBSTGEVBOS

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.
3. The relation between junction temperature, ambient temperature and Total Power dissipated in IC is T
4. The pins which are not defined may not be loaded by external signals
MAXIMUM RATINGS
Power Dissipation and Thermal Characteristics
V
Comparator Inverting Input (Pin 5)
Darlington Switch Collector (Pin 1)
Darlington Switch Emitter (Pin 2) (Transistor OFF)
Darlington Switch Collector to Emitter (Pins 1−2)
Darlington Switch Current
I
Timing Capacitor (Pin 3)
PDIP−8
SOIC−8
DFN−8
Storage Temperature Range
Maximum Junction Temperature
Operating Junction Temperature Range (Note 3)
pk
CC
Thermal Resistance Junction−to−Air
Thermal Resistance Junction−to−Air
Thermal Resistance Junction−to−Air
Thermal Resistance Junction−to−Case
NCP3065, NCV3065
Sense (Pin 7)
Pin 1−8: Human Body Model 2000 V per AEC Q100−002; 003 or JESD22/A114; A115
Machine Model Method 200 V
(Pin 6)
(measured vs. pin 4, unless otherwise noted)
Rating
http://onsemi.com
3
Symbol
T
V
V
V
V
T
R
R
R
R
J(MAX)
V
V
V
SWCE
I
TCAP
SWC
SWE
SW
STG
T
IPK
qJA
qJA
qJA
qJC
CC
CII
J
−0.2 to V
−0.2 to +V
−0.6 to +V
−0.2 to +1.4
−65 to +150
−40 to +125
0 to +40
0 to +40
0 to +40
Value
+150
J
100
180
1.5
78
14
= T
CC
A
+ 0.2
CC
CC
+ R
q •
P
D
°C/W
°C/W
°C/W
Unit
°C
°C
°C
V
V
V
V
V
A
V
V