PESD1CAN,215 NXP Semiconductors, PESD1CAN,215 Datasheet - Page 9
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PESD1CAN,215
Manufacturer Part Number
PESD1CAN,215
Description
DIODE ESD PROTECTION SOT23
Manufacturer
NXP Semiconductors
Datasheet
1.PESD1CAN215.pdf
(12 pages)
Specifications of PESD1CAN,215
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Reverse Standoff (typ)
24V
Voltage - Breakdown
25.4V
Power (watts)
200W
Polarization
2 Channel Array - Bidirectional
Mounting Type
Surface Mount
Polarity
Bidirectional
Clamping Voltage
40 V
Operating Voltage
24 V
Breakdown Voltage
27.8 V
Termination Style
SMD/SMT
Peak Surge Current
3 A
Peak Pulse Power Dissipation
200 W
Capacitance
17 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Dimensions
2.5 mm W x 3 mm L x 1.1 mm H
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4032-2
934059097215
PESD1CAN T/R
PESD1CAN T/R
934059097215
PESD1CAN T/R
PESD1CAN T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PESD1CAN,215
Manufacturer:
NXP Semiconductors
Quantity:
9 350
NXP Semiconductors
10. Soldering
PESD1CAN_4
Product data sheet
Fig 10. Reflow soldering footprint SOT23 (TO-236AB)
Fig 11. Wave soldering footprint SOT23 (TO-236AB)
4.60
3.00
4.00
0.85
0.85
1.20
1.30
Rev. 04 — 15 February 2008
2
2
3.40
2.80
4.50
2.90
2.50
1.00
3.30
3
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
0.60
(3x)
Dimensions in mm
preferred transport direction during soldering
sot023
2.70
CAN bus ESD protection diode
solder lands
solder resist
occupied area
Dimensions in mm
PESD1CAN
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2008. All rights reserved.
sot023
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