TAJE337M004RNJ AVX Corporation, TAJE337M004RNJ Datasheet - Page 8
![CAPACITOR TANT 330UF 4V 20% SMD](/photos/1/6/10689/taj_tps_tpm_series_7_3l_4_3w_sml.jpg)
TAJE337M004RNJ
Manufacturer Part Number
TAJE337M004RNJ
Description
CAPACITOR TANT 330UF 4V 20% SMD
Manufacturer
AVX Corporation
Series
TAJr
Type
Moldedr
Specifications of TAJE337M004RNJ
Capacitance
330µF
Voltage - Rated
4V
Tolerance
±20%
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
2917 (7343 Metric)
Size / Dimension
0.287" L x 0.169" W (7.30mm x 4.30mm)
Height
0.161" (4.10mm)
Manufacturer Size Code
E
Features
General Purpose
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Spacing
-
Esr (equivalent Series Resistance)
-
Lead Free Status / RoHS Status
Compliant, Lead free / RoHS Compliant
Other names
TAJE337M004R
TAJE337M004R
TAJE337M004R
Technical Summary and
Application Guidelines
The pentoxide (Ta
m/V
Dielectric thickness (d)
Electric Field strength
The next stage is the production of the cathode plate. This is
achieved by pyrolysis of Manganese Nitrate into Manganese
Dioxide.
The “pellet” is dipped into an aqueous solution of nitrate and
then baked in an oven at approximately 250°C to produce
the dioxide coat. The chemical equation is:
36
Mn (NO
3
)
2
2
Figure 3. Dielectric Layer
O
5
) dielectric grows at a rate of 1.7 x 10
Mn O
Anode
= 35 x 1.7 x 10
= 0.06 µm
= Working Voltage / d
= 167 KV/mm
2
+ 2NO
2
Manganese
Dioxide
-9
Tantalum
Dielectric
Oxide Film
Graphite
-9
Figure 5.
Silver Layer
This process is repeated several times through varying
specific densities of nitrate to build up a thick coat over
all internal and external surfaces of the “pellet”, as shown in
Figure 4.
The “pellet” is then dipped into graphite and silver to
provide a good connection to the Manganese Dioxide
cathode plate. Electrical contact is established by deposition
of carbon onto the surface of the cathode. The carbon
is then coated with a conductive material to facilitate
connection to the cathode termination (see Figure 5).
Packaging is carried out to meet individual specifications and
customer requirements. This manufacturing technique is
adhered to for the whole range of AVX tantalum capacitors,
which can be sub-divided into four basic groups: Chip /
Resin dipped / Rectangular boxed / Axial.
Further information on the production of Tantalum
Capacitors can be obtained from the technical paper “Basic
Tantalum Technology”, by John Gill, available from your local
AVX representative.
Outer
Figure 4. Manganese Dioxide Layer
Epoxy
Silver
Connection
Cathode
Dioxide
Manganese
Dielectric
Oxide Film
Tantalum