PIC12F629-I/P Microchip Technology, PIC12F629-I/P Datasheet - Page 127
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PIC12F629-I/P
Manufacturer Part Number
PIC12F629-I/P
Description
IC MCU CMOS FLASH-BASE 8BIT 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F629-I/P
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Data Rom Size
128 B
Height
3.3 mm
Length
9.27 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F629-I/P
Manufacturer:
CML
Quantity:
101
Company:
Part Number:
PIC12F629-I/P
Manufacturer:
MICROCHIP
Quantity:
2
Part Number:
PIC12F629-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
APPENDIX A:
Revision A
This is a new data sheet.
Revision B
Added characterization graphs.
Updated specifications.
Added notes to indicate Microchip programmers
maintain all Calibration bits to factory settings and the
PIC12F675 ANSEL register must be initialized to
configure pins as digital I/O.
Updated MLF-S package name to DFN-S.
Revision C
Revision D (01/2007)
Updated Package Drawings; Replace PICmicro with
PIC; Revised Product ID example (b).
Revision E (03/2007)
Replaced Package Drawings (Rev. AM); Replaced
Development Support Section.
Revision F (09/2009)
Updated Registers to new format; Added information to
the “Package Marking Information” (8-Lead DFN) and
“Package Details” sections (8-Lead Dual Flat, No Lead
Package (MD) 4X4X0.9 mm Body (DFN)); Added Land
Patterns for SOIC (SN) and DFN-S (MF) packages;
Updated Register 3-2; Added MD Package to the
Product identification System chapter; Other minor
corrections.
Revision G (03/2010)
Updated the Instruction Set Summary section, adding
pages 76 and 77.
2010 Microchip Technology Inc.
DATA SHEET
REVISION HISTORY
APPENDIX B:
The differences between the PIC12F629/675 devices
listed in this data sheet are shown in Table B-1.
TABLE B-1:
Feature
A/D
PIC12F629/675
DEVICE DIFFERENCES
DEVICE
DIFFERENCES
PIC12F629
No
DS41190G-page 127
PIC12F675
Yes