PIC16F716-I/P Microchip Technology, PIC16F716-I/P Datasheet - Page 101
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PIC16F716-I/P
Manufacturer Part Number
PIC16F716-I/P
Description
IC PIC MCU FLASH 2KX14 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Package
18PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP
Quantity:
5 373
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 12-2:
© 2007 Microchip Technology Inc.
1A
1
2
3*
4*
Note 1:
Param
No.
*
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
F
T
Tcy
TosL,
TosH
TosR,
TosF
Sym
OSC
OSC
These parameters are characterized but not tested.
only and are not tested.
Instruction cycle period (T
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min”
values with an external clock applied to the OSC1/CLKIN pin.
When an external clock input is used, the “Max” cycle time limit is “DC” (no clock) for all devices.
EXTERNAL CLOCK TIMING REQUIREMENTS
Ext. Clock Input Frequency
Oscillator Frequency
External CLKIN Period
Oscillator Period
Instruction Cycle Time
External Clock in (OSC1) High or
Low Time
External Clock in (OSC1) Rise or
Fall Time
Characteristic
(1)
CY
(1)
) equals four times the input oscillator time base period. All specified values
(1)
(1)
(1)
Min
250
250
250
200
100
DC
DC
DC
DC
0.1
2.5
50
50
15
—
—
—
4
5
5
5
Typ†
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
10,000
Max
200
200
250
DC
20
20
25
50
15
—
—
—
—
—
—
—
—
4
4
4
Units
MHz RC and XT Osc modes
MHz HS Osc mode
MHz RC Osc mode
MHz XT Osc mode
MHz HS Osc mode
kHz
kHz
ns
μs
ns
ns
μs
ns
ns
μs
ns
ns
ns
ns
ns
ns
LP Osc mode
LP Osc mode
RC and XT Osc modes
HS Osc mode
LP Osc mode
RC Osc mode
XT Osc mode
HS Osc mode
LP Osc mode
T
XT oscillator
LP oscillator
HS oscillator
XT oscillator
LP oscillator
HS oscillator
CY
= 4/F
PIC16F716
OSC
Conditions
DS41206B-page 99