PIC16F716-I/P Microchip Technology, PIC16F716-I/P Datasheet - Page 128
![IC PIC MCU FLASH 2KX14 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F716-I/P
Manufacturer Part Number
PIC16F716-I/P
Description
IC PIC MCU FLASH 2KX14 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F716-ISO.pdf
(136 pages)
4.PIC16F716-ISO.pdf
(12 pages)
5.PIC16F716-ESO.pdf
(126 pages)
Specifications of PIC16F716-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 8-bit
Package
18PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3-DB16F716 - BOARD DAUGHTER ICEPIC3AC162054 - HEADER INTERFACE ICD2 16F716ACICE0202 - ADAPTER MPLABICE 18P 300 MILAC164010 - MODULE SKT PROMATEII DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP
Quantity:
5 373
Part Number:
PIC16F716-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F716
APPENDIX C:
This section discusses how to migrate from a baseline
device (i.e., PIC16C5X) to a mid-range device (i.e.,
PIC16F716).
The following are the list of modifications over the
PIC16C5X microcontroller family:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Wake-up from Sleep through interrupt is added.
11. Two separate timers, Oscillator Start-up Timer
12. PORTB has weak pull-ups and interrupt-on-
13. T0CKI pin is also a port pin (RA4) now.
14. FSR is made a full eight-bit register.
15. “In-circuit serial programming” is made possible.
16. PCON STATUS register is added with a Power-
17. Brown-out protection circuitry has been added.
DS41206B-page 126
Instruction word length is increased to 14-bits.
This allows larger page sizes both in program
memory (2K now as opposed to 512 before) and
register file (128 bytes now versus 32 bytes
before).
A PC high latch register (PCLATH) is added to
handle program memory paging. Bits PA2, PA1,
PA0 are removed from STATUS register.
Data memory paging is redefined slightly.
STATUS register is modified.
Four new instructions have been added:
RETURN, RETFIE, ADDLW, and SUBLW.
Two instructions TRIS and OPTION are being
phased out although they are kept for
compatibility with PIC16C5X.
OPTION_REG and TRIS registers are made
addressable.
Interrupt capability is added. Interrupt vector is
at 0004h.
Stack size is increased to 8 deep.
Reset vector is changed to 0000h.
Reset of all registers is revisited. Five different
Reset (and wake-up) types are recognized.
Registers are reset differently.
(OST) and Power-up Timer (PWRT) are
included for more reliable power-up. These
timers
unnecessary delays on power-up and wake-up.
change feature.
The user can program PIC16F716 devices
using only five pins: V
(clock) and RB7 (data in/out).
on Reset Status bit (POR).
Controlled by Configuration Word bits BOREN
and BORV. Brown-out Reset ensures the device
is placed in a Reset condition if V
a fixed setpoint.
are
invoked
MIGRATION FROM
BASE-LINE TO
MID-RANGE DEVICES
DD
selectively
, V
SS
, MCLR/V
DD
dips below
to
PP
, RB6
avoid
To convert code written for PIC16C5X to PIC16F716,
the user should take the following steps:
1.
2.
3.
4.
5.
.
Note 1: This device has been designed to
Remove any program memory page select
operations (PA2, PA1, PA0 bits) for CALL, GOTO.
Revisit any computed jump operations (write to
PC or add to PC, etc.) to make sure page bits
are set properly under the new scheme.
Eliminate any data memory page switching.
Redefine data variables to reallocate them.
Verify all writes to STATUS, OPTION, and FSR
registers since these have changed.
Change Reset vector to 0000h
2: The user should verify that the device
perform to the parameters of its data
sheet. It has been tested to an electrical
specification designed to determine its
conformance with these parameters. Due
to process differences in the manufacture
of this device, this device may have differ-
ent performance characteristics than its
earlier version. These differences may
cause this device to perform differently in
your application than the earlier version of
this device.
oscillator
expected. Adjusting the loading capacitor
values and/or the Oscillator mode may be
required.
© 2007 Microchip Technology Inc.
starts
and
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