PIC18F44J10-I/P Microchip Technology, PIC18F44J10-I/P Datasheet - Page 183
![IC PIC MCU FLASH 8KX16 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F44J10-I/P
Manufacturer Part Number
PIC18F44J10-I/P
Description
IC PIC MCU FLASH 8KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F24J10-ISO.pdf
(368 pages)
3.PIC18F24J10-ISO.pdf
(6 pages)
4.PIC18F24J10-ISO.pdf
(6 pages)
5.PIC18F24J10-ISO.pdf
(12 pages)
6.PIC18LF24J10-ISS.pdf
(32 pages)
7.PIC18F44J10-IPT.pdf
(358 pages)
Specifications of PIC18F44J10-I/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
32
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183022, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162074 - HEADER INTRFC MPLAB ICD2 44TQFPMA180013 - MODULE PLUG-IN 18F45J10 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28PAC164329 - MODULE SKT FOR 40DIP 18F45J10
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F44J10-I/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Company:
Part Number:
PIC18F44J10-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F44J10-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC18F24J10-ISO PDF datasheet #2
- PIC18F24J10-ISO PDF datasheet #3
- PIC18F24J10-ISO PDF datasheet #4
- PIC18F24J10-ISO PDF datasheet #5
- PIC18LF24J10-ISS PDF datasheet #6
- PIC18F44J10-IPT PDF datasheet #7
- Current page: 183 of 358
- Download datasheet (6Mb)
15.4.17.1
During a Start condition, a bus collision occurs if:
a)
b)
During a Start condition, both the SDAx and the SCLx
pins are monitored.
If the SDAx pin is already low, or the SCLx pin is
already low, then all of the following occur:
• the Start condition is aborted;
• the BCLxIF flag is set; and
• the MSSP module is reset to its Idle state
The Start condition begins with the SDAx and SCLx
pins deasserted. When the SDAx pin is sampled high,
the
SSPxADD<6:0> and counts down to ‘0’. If the SCLx pin
is sampled low while SDAx is high, a bus collision
occurs, because it is assumed that another master is
attempting to drive a data ‘1’ during the Start condition.
FIGURE 15-26:
© 2007 Microchip Technology Inc.
(Figure 15-26).
SDAx
SCLx
SEN
BCLxIF
S
SSPxIF
SDAx or SCLx are sampled low at the beginning
of the Start condition (Figure 15-26).
SCLx is sampled low before SDAx is asserted
low (Figure 15-27).
Baud
Bus Collision During a Start
Condition
Rate
condition if SDAx = 1, SCLx = 1
Set SEN, enable Start
Generator
BUS COLLISION DURING START CONDITION (SDAx ONLY)
SDAx sampled low before
Start condition. Set BCLxIF.
S bit and SSPxIF set because
SDAx = 0, SCLx = 1.
SDAx goes low before the SEN bit is set.
S bit and SSPxIF set because
SDAx = 0, SCLx = 1.
Set BCLxIF,
is
loaded
from
Preliminary
SSPxIF and BCLxIF are
cleared in software
PIC18F45J10 FAMILY
If the SDAx pin is sampled low during this count, the
BRG is reset and the SDAx line is asserted early
(Figure 15-28). If, however, a ‘1’ is sampled on the
SDAx pin, the SDAx pin is asserted low at the end of
the BRG count. The Baud Rate Generator is then
reloaded and counts down to ‘0’. If the SCLx pin is
sampled as ‘0’ during this time, a bus collision does not
occur. At the end of the BRG count, the SCLx pin is
asserted low.
Note:
SEN cleared automatically because of bus collision.
MSSP module reset into Idle state.
The reason that bus collision is not a factor
during a Start condition is that no two bus
masters can assert a Start condition at the
exact same time. Therefore, one master
will always assert SDAx before the other.
This condition does not cause a bus colli-
sion because the two masters must be
allowed to arbitrate the first address
following the Start condition. If the address
is the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SSPxIF and BCLxIF are
cleared in software
DS39682C-page 181
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