PIC16LF1939-I/ML Microchip Technology, PIC16LF1939-I/ML Datasheet - Page 109

• Manufacturer Part Number: PIC16LF1939-I/ML
• Description: IC MCU 8BIT FLASH 44QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16LF1939-I/ML

• Core Size: 8-Bit
• Program Memory Size: 28KB (16K x 14)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Controller Family/series: PIC16LF
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 1024Byte
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

9.0
The Power-down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions
exist:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. Resets other than WDT are not affected by
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following condi-
tions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be
pulled to V
rents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 16.0 “Digital-to-Analog Con-
verter (DAC) Module” and Section 14.0 “Fixed Volt-
age Reference (FVR)” for more information on these
modules.
 2009 Microchip Technology Inc.
WDT will be cleared but keeps running, if
enabled for operation during Sleep.
PD bit of the STATUS register is cleared.
TO bit of the STATUS register is set.
CPU clock is disabled.
31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
Timer1 oscillator is unaffected and peripherals
that operate from it may continue operation in
Sleep.
ADC is unaffected, if the dedicated FRC clock is
selected.
Capacitive Sensing oscillator is unaffected.
I/O ports maintain the status they had before
SLEEP was executed (driving high, low or high-
impedance).
Sleep mode.
POWER-DOWN MODE (SLEEP)
DD
or V
SS
externally to avoid switching cur-
Preliminary
9.1
The device can wake-up from Sleep through one of the
following events:
1.
2.
3.
4.
5.
6.
The first three events will cause a device Reset. The
last three events are considered a continuation of pro-
gram execution. To determine whether a device Reset
or wake-up event occurred, refer to Section 6.10
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will call the Interrupt Ser-
vice Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
PIC16F193X/LF193X
External Reset input on MCLR pin, if enabled
BOR Reset, if enabled
POR Reset
Watchdog Timer, if enabled
Any external interrupt
Interrupts by peripherals capable of running dur-
ing Sleep (see individual peripheral for more
information)
Wake-up from Sleep
DS41364D-page 109