PIC16LF72-I/ML Microchip Technology, PIC16LF72-I/ML Datasheet - Page 122

• Manufacturer Part Number: PIC16LF72-I/ML
• Description: IC PIC MCU FLASH 2KX14 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16LF72-I/ML

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: FLASH
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification
• Eeprom Size: -

PIC16F72
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS39597C-page 120
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
MIN
0°
c
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
© 2007 Microchip Technology Inc.
10.50
MAX
2.00
1.85
8.20
5.60
0.95
0.25
0.38
8°
–
φ
L