PIC24FJ16GA002-I/SP Microchip Technology, PIC24FJ16GA002-I/SP Datasheet - Page 226

• Manufacturer Part Number: PIC24FJ16GA002-I/SP
• Description: IC PIC MCU FLASH 16K 28-DIP
• Manufacturer: Microchip Technology
• Series: PIC® 24Fr

Specifications of PIC24FJ16GA002-I/SP

• Core Size: 16-Bit
• Program Memory Size: 16KB (5.5K x 24)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, PMP, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC24
• No. Of I/o's: 21
• Ram Memory Size: 4KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• No. Of Pwm Channels: 5
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 4 KB
• Interface Type: I2C, IrDA, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240011, MA240013, AC164127, DM300027, DV164033, DM240002
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• Package: 28SPDIP
• Device Core: PIC
• Family Name: PIC24
• Maximum Speed: 32 MHz
• Operating Supply Voltage: 2.5|3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM240011 - KIT STARTER MPLAB FOR PIC24F MCUAC162088 - HEADER MPLAB ICD2 24FJ64GA004 28AC164337 - MODULE SOCKET FOR PM3 40DIPDV164033 - KIT START EXPLORER 16 MPLAB ICD2
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24FJ64GA004 FAMILY
26.1
FIGURE 26-1:
TABLE 26-1:
TABLE 26-2:
DS39881B-page 224
PIC24FJ64GA Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance, Theta-
= Σ ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
W
V
x (I
DD
DDCORE
HEN
3.00V
2.75V
2.50V
2.25V
2.00V
PIC24FJ64GA004 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
the voltage regulator is disabled, V
Characteristic
OH
– Σ I
} x I
≤ V
Rating
OH
DD
OH
)
16 MHz
) + Σ (V
PIC24FJ64GA004/32GA004/64GA002/32GA002
≤ 3.6V.
OL
x I
OL
Preliminary
)
Frequency
MAX
JA
(θ
DD
= (64 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
A
D
J
must be maintained so that
DDCORE
33.7
39.3
Min
Typ
-40
-40
49
28
(T
© 2007 Microchip Technology Inc.
P
32 MHz
– 2V) + 16 MHz.
J
INT
– T
Max
Typ
—
—
—
—
—
—
+ P
A
)/θ
2.75V
2.25V
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W